Effect of SnO 2 reinforcement on creep property of Sn–Ag–Cu solders

Wattanakornphaiboon, Anattiya; Canyook, Rungsinee; Fakpan, Kittichai

doi:10.1016/j.matpr.2017.10.092

Cited by 11 publications

(4 citation statements)

References 15 publications

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“…In this research, the size of the nanoparticles was an average of 42nm and at this size, it is not possible for any reaction to take place. Furthermore, Wattanakornphaiboon et al, [82] states that nanoparticles will not involve in any diffusion with the Sn due to nature of its low solubility. Consequently, the Mo nanoparticles will opt to accumulate along the grain boundaries (high-energy area) and the surface of the molten SB solder alloy.…”

Section: Discussion On Mechanisms Influencing the Behaviour Of Mo Nanmentioning

confidence: 99%

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Singh

Durairaj

How

2020

ARFMTS

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The Sn-58Bi (SB) lead free solder alloy tested in this research with addition of 3% Molybdenum (Mo) nanoparticles equivalent to 0.6g mass to analyse the influences in the thermal, microstructure and microhardness. Elevation of 3.8°C was observed from the Differential Scanning Calorimetry (DSC) for the 3% Mo nanoparticles added SB solder alloy compared to the bare Sn-58Bi (SB) solder alloy that has a melting temperature of 142.25°C. The microstructures of the reinforced SB solder alloy were refined with closer lamellar structures of ?-Sn and Bi phases compared to the unreinforced SB solder. The SEM/EDX and X-ray Diffraction (XRD) results validate the presence of the 3% Mo nanoparticles in the SB solder. Mechanical properties by means of Vickers microhardness of the Mo reinforced solder alloy showed an increment in hardness value by 2% compared to the bare SB solder alloy. The presence of 3% Mo as discrete particles (dispersion strengthening) contributes to the increase on the hardness value. The introduction of 3% Mo in to the SB solder alloy resulted in increase in the hardness due to the refinement of the microstructure and at the same time allows low temperature soldering in the electronic packaging industry.

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Section: Discussion On Mechanisms Influencing the Behaviour Of Mo Nanmentioning

confidence: 99%

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Singh

Durairaj

How

2020

ARFMTS

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“…82 Current lead-free solders can be divided into binary solders, ternary solders and miscellaneous additions. 83 Among them, the Sn-Ag-Cu alloy is considered to be the most benecial and promising lead-free brazing material, [84][85][86] with a melting point between 217 °C and 225 °C. [87][88][89] The melting point and other properties of the solder are closely related to the temperature required for desoldering.…”

Section: Desolderingmentioning

confidence: 99%

The reuse of electronic components from waste printed circuit boards: a critical review

Zhao

Fei

et al. 2023

Environ. Sci.: Adv.

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“…Among the low-Ag-containing SAC solders, Sn-1.0Ag-0.5Cu (wt.%) solder is one of the most promising solder reducing the cost concerns in commercial production [12][13][14]. Moreover, Sn-1.0Ag-0.5Cu solder with low Ag content have been yielded less possibility to form bulk IMCs [1,15,16].…”

Section: Introductionmentioning

confidence: 99%

Characterization of Cooling Rate and Microstructure of Rapidly Solidified Spherical Mono-Sized Sn-1.0Ag-0.5Cu Particles

Wang

et al. 2019

MSF

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Spherical mono-sized Sn-1.0Ag-0.5Cu (wt.%) particles with diameter ranging from 124.0 to 337.4μm were prepared by the pulsated orifice ejection method (termed “POEM”).These spherical Sn-1.0Ag-0.5Cu particles exhibit a good spherical shape and a narrow size distribution, suggesting that liquid Sn-1.0Ag-0.5Cu can completely break the balance between the surface tension and the liquid static pressure in the crucible micropores and accurately control the volume of the droplets. Furthermore, the relationship between cooling rate and microstructures of spherical Sn-1.0Ag-0.5Cu particles was studied with a specific focus on different particle diameter during the rapid solidification. The cooling rate of spherical Sn-1.0Ag-0.5Cu particles with different diameter was evaluated by the Newton’s cooling model. It is revealed that the cooling rate decreases gradually with the increase of particle size during the rapidly solidified process. When the particle diameter is equal to 75 μm, the cooling rate of the Sn-1.0Ag-0.5Cu particle achieves 4.30×103 K/s which indicates that smaller particles can rapidly solidified due to their higher cooling rate. Meanwhile, the cooling rate decreases rapidly when the particle diameter increases between 75 and 100 μm. Furthermore, the different particle diameter with different cooling rate has a great influence on the solidification microstructure of Sn-1.0Ag-0.5Cu particles. The cooling rate and grain boundary size decreases with the increase of particle diameter during the rapid solidification. In addition, the phase size of βSn increases with the decrease of particle size. Smaller particles have relatively high cooling rate and it gives less solidification time as compared to larger particles. It is an effective route for fabrication of high-quality spherical Sn-1.0Ag-0.5Cu particles. Keywords: Spherical Sn-1.0Ag-0.5Cu particles; Rapid solidification; Structural; Cooling rate

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Effect of SnO 2 reinforcement on creep property of Sn–Ag–Cu solders

Cited by 11 publications

References 15 publications

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

The reuse of electronic components from waste printed circuit boards: a critical review

Characterization of Cooling Rate and Microstructure of Rapidly Solidified Spherical Mono-Sized Sn-1.0Ag-0.5Cu Particles

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