Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Lee, Choong‐Jae; Min, Kyung Deuk; Park, Hyun Joon; Kim, Jae‐Ha; Jung, Seung‐Boo

doi:10.1007/s13391-019-00176-1

Cited by 14 publications

(5 citation statements)

References 41 publications

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“…When the concentration of MWCNTs in the plating solution was increased to 10 g/L, they surprisingly found that the shear energy of the Sn-MWCNT composite increased by 50%. Other researchers also indicated that the shear strength, fracture energy, and bending reliability of Sn-58Bi solder increased by about 21%, 23%, and 25%, respectively, after adding 0.1 wt.% Sn-MWCNTs [97].…”

Section: Composite Solder Reinforced With Ag-cntsmentioning

confidence: 92%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

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Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of CNTs, introduces the preparation methods of CNT composite solders, and focuses on the review of tin-based lead-free solders reinforced with unmodified CNTs and metal-modified CNTs. The addition of CNTs can effectively improve the ultimate tensile strength, microhardness, shear strength, and creep resistance of the solder. However, the practical application of CNT composite solders has been a challenge for researchers for decades. The most significant issue is uniform dispersion due to the large density and surface differences between CNTs and solders. Other concerns are the structural integrity of CNTs and their limited addition amount, solder wettability, and interfacial bonding. CNT composite solders can only be widely used in a real sense when these challenges are properly addressed and overcome. At present, there is a lack of comprehensive reviews covering the structure, the strengthening mechanism, the preparation method of CNT composite solders, and the influence of CNT types on their strengthening effects. Therefore, this paper aims to fill this gap and contribute to solving the problems faced by the application of CNTs in solder. Future work is expected to focus on improving the dispersion and bonding of CNTs and optimizing the preparation method.

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Section: Composite Solder Reinforced With Ag-cntsmentioning

confidence: 92%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

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“…Moreover, the novel carbon-based nanometer materials, such as CNTs and graphene, are also selected to adjust the Sn-Bi solders. Lee et al [35,61] investigated the influence of Sn-decorated multiwalled carbon nanotube (MWCNT) nanoparticles and Ag-decorated MWCNT on the transformation of microstructure of Sn-58Bi solder. They demonstrated that the IMC thickness of composite solder joints was inhibited because of the doping of Sn-MWCNT nanoparticles and the best addition was 0.1 wt% considering the mechanical properties of solder joints.…”

Section: 22mentioning

confidence: 99%

“…It was found that the tensile strength of composite solder was proportional to the doping of MWCNTs, which increased by 47.6% when the addition of MWCNTs was 3 wt%. Lee et al [35,61] investigated the influence of Sn-decorated MWCNT nanoparticles and Ag-decorated MWCNT on the mechanical properties of Sn-58Bi solder. They found that the doping of Sn-decorated MWCNT nanoparticles could improve the mechanical properties and the optimum addition was 0.1 wt% [61] and the 15 Journal of Nanomaterials fracture energy and shear strength increased by 80% and 16%, respectively, when the addition of Ag-MWCNTs was 0.05 wt% [35].…”

Section: Mechanical Propertiesmentioning

confidence: 99%

“…Lee et al [35,61] investigated the influence of Sn-decorated MWCNT nanoparticles and Ag-decorated MWCNT on the mechanical properties of Sn-58Bi solder. They found that the doping of Sn-decorated MWCNT nanoparticles could improve the mechanical properties and the optimum addition was 0.1 wt% [61] and the 15 Journal of Nanomaterials fracture energy and shear strength increased by 80% and 16%, respectively, when the addition of Ag-MWCNTs was 0.05 wt% [35]. He et al [108] demonstrated that the bending strength of Sn-58Bi-0.03CNTs composite solder increased by 10.5% compared with the plain Sn-58Bi solder.…”

Section: Mechanical Propertiesmentioning

confidence: 99%

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Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Wang

Liu

et al. 2020

Journal of Nanomaterials

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With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.

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“…With the development of miniaturization in electronic packaging, the requirements of high reliability solder joint have attracted increasing attention [1,2]. Owing to the importance of reliable connection between electronic component and conductive substrates, the joint should provide suitable mechanical, electrical and thermal properties to achieve the functions of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

Xue

Tao

et al. 2020

Applied Sciences

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In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.

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Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder

Cited by 14 publications

References 41 publications

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

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