Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Terashima, Shin-Ichi; Kariya, Yoshiharu; Hosoi, Takuya; Tanaka, Masamoto

doi:10.1007/s11664-003-0125-z

Cited by 158 publications

(103 citation statements)

References 10 publications

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“…Additionally, Zhao has pointed out that phase coarsening after aging treatment leads to fatigue crack growth in eutectic Sn-Pb alloy. 12) Namely, fine Sn grains not only are resistance for transgranular crack propagation in Sn-based alloys [5][6][7] but also assist plastic deformation. This indicates that suppression of Sn grain growth is important to maintain long fatigue life.…”

Section: Microstructure After Thermal Fatiguementioning

confidence: 99%

“…2) Although Sn-xAg-Cu solders (x: from 3 to 4 in mass%) are becoming major lead-free solder compositions for flip chip because of their good reliability with relatively low melting points, the best composition of the Sn-Ag-Cu alloy has not been clarified yet from the viewpoints of thermal fatigue properties. 3,4) It has been reported that thermal 5) and isothermal fatigue properties 6) of Sn-xAg-0.5Cu (x ¼ 1, 2, 3 and 4 in mass%) flip chip interconnects are strongly correlated to the silver content, and solder joints with higher silver content (x ¼ 3 and 4) have better fatigue resistance than those with lower one (x ¼ 1 and 2). However, solder alloys with lower silver content are required from the viewpoint of material cost because silver is one of the expensive resources.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-<i>x</i>Ni Flip Chip Interconnects

Terashima

Tanaka

2004

Mater. Trans.

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Thermal fatigue properties of Sn-1.2Ag-0.5Cu-xNi (x: 0.02, 0.05, 0.10 and 0.20 mass%) flip chip interconnects was investigated to find out an ideal nickel composition. Sn-1.2Ag-0.5Cu-xNi (x: 0.05, 0.10 and 0.20) had longer thermal fatigue life than Sn-1.2Ag-0.5Cu-0.02Ni. Cracks developed near solder/chip interface for all the bumps tested, and fracture due to thermal strain was a mixed mode, both transgranular and intergranular. Sn grain growth after thermal cycling was suppressed for Sn-1.2Ag-0.5Cu-xNi (x: 0.05, 0.10 and 0.20) solder joints, while Sn grains grew faster for x ¼ 0:02, which suggests that suppression of Sn grain growth enhanced thermal fatigue endurance. Therefore, thermal fatigue properties of Sn-1.2Ag-0.5Cu-xNi (x: 0.02, 0.05, 0.10 and 0.20) solder joint correlated to its microstructure, and the addition of 0.05 mass%Ni is required to enhance thermal fatigue endurance.

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Section: Microstructure After Thermal Fatiguementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-<i>x</i>Ni Flip Chip Interconnects

Terashima

Tanaka

2004

Mater. Trans.

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“…It is well known that needle-shaped Ag 3 Sn and plate-shaped Au 4 Sn are formed in solder bulk during Sn-Ag-Cu soldering on ENIG surface finish (reflow), isothermal aging, and thermo-mechanical cycling (TMT). 1,28,[33][34][35][36][37] Large IMC particles, exhibiting brittle properties, greatly affect plastic deformation of solder. 33,38 As a result, the straindelocalized boundary between large IMC particles and Sn (solder matrix) can trigger crack propagation.…”

Section: Observation Of the Soldering Interconnection Microstructurementioning

confidence: 99%

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Miyauchi

Yamashita

Suzuki

et al. 2014

Journal of Elec Materi

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The self-assembly of solder powder on pads is attractive as a novel interconnection method between chips and substrates. However, the solder used in this method is limited to Sn-58Bi and Sn-52In. In contrast, Sn-3Ag-0.5Cu has been relatively less studied despite its wide use as a lead-free solder in assembling semiconductor packages. Hence, here, polymeric materials incorporating Sn-3Ag-0.5Cu solder powder were investigated for the self-assembly of the solder on pads at temperatures up to 260°C in a lead-free reflow process. The self-assembly of the solder was observed with an optical microscope through transparent glass chips placed on substrates covered with the polymeric materials incorporating the solder powder. Differential scanning calorimetry measurements were performed to confirm the behaviors of the reaction of the resins and the melting of the solder. When epoxy resin with a fluxing additive was used as a matrix, self-assembly of the solder was prevented by the cross-linking reaction. Conversely, when thermoplastic resin containing carboxyl groups was used as a matrix, the self-assembly of solder was successfully achieved in the absence of fluxing additives. The shear strength of interconnection using reflowfilm with lamination was sufficient and significantly increased during the reflow process. However, the shear strength of the reflowfilm showed cohesive failure, possibly because of the brittle intermetallic compounds (Ag 3 Sn, Au 4 Sn) network in bulk was lower than that of conventional solder paste that showed interfacial failure after the reflow process with a rapid cooling rate.

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“…Special attention is given to the effect of Ni, one of the main alloying elements on microstructure, mechanical properties and fracture modes [4][5][6]. In regard to reliability, most researches focused on the examination of failure modes and thermal cycle performance of Ball Grid Array (BGA) solder joints [1,[7][8]. It is generally accepted that besides chemical composition and microstructure, the geometry of the solder joints strongly affects the resistance against thermal fatigue.…”

Section: Introductionmentioning

confidence: 99%

“…In such a case, the thickness of the solder varies around the pin and from top to bottom of the PCB. It is well known that the difference in thermal expansion coefficients of the solder, pin and PCB is [1,[7][8]. Different solder thickness can result uneven thermal stresses around the pins which can influence crack initiation.…”

Section: Introductionmentioning

confidence: 99%

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

Molnár¹,

Benke²,

Gácsi³

2017

Archives of Metallurgy and Materials

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In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints' lifetime.

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Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Cited by 158 publications

References 10 publications

Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-<i>x</i>Ni Flip Chip Interconnects

Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-<i>x</i>Ni Flip Chip Interconnects

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

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