2021
DOI: 10.1016/j.polymer.2021.124068
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Effect of side groups on glass transition temperatures of Poly(ethoxy/phenoxy)phosphazenes: Prediction and synthesis

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Cited by 11 publications
(5 citation statements)
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“…Compared to the control sample PI‐200 ( T g = 333 °C), the T g of PI films with quinoline derivatives decreased due to the graft of bulky side groups. [ 48 ] However, both PI‐4QL and PI‐NQL still exhibited T g above 290 °C, meeting the requirements for advanced packaging applications. These results suggested that NQL showed better thermal stability and was more conducive to protecting the thermal properties of PI films than QL.…”
Section: Resultsmentioning
confidence: 99%
“…Compared to the control sample PI‐200 ( T g = 333 °C), the T g of PI films with quinoline derivatives decreased due to the graft of bulky side groups. [ 48 ] However, both PI‐4QL and PI‐NQL still exhibited T g above 290 °C, meeting the requirements for advanced packaging applications. These results suggested that NQL showed better thermal stability and was more conducive to protecting the thermal properties of PI films than QL.…”
Section: Resultsmentioning
confidence: 99%
“…All these aspects are crucial when these polymers are used to control drug release [ 80 ], in drug delivery applications [ 81 , 82 ], or as a microencapsulation material, as well as an immunoadjuvant [ 15 ]. In very recent work, Wang et al rationalized the effect of the side groups on the glass transition polymers starting from a system with 150 repeat units [ 83 ], but a great advance in the MD simulations has been made by Chen et al [ 84 ]. In this study, the DREIDING force field with the Lennard–Jones potential was used, and they obtained an in situ dynamic polymerization procedure to make, test, and tune the thermos-mechanical properties of polyphosphazenes via MD simulations, which was obtained.…”
Section: Synthesis and Characterizationsmentioning
confidence: 99%
“…However, as a thermal insulation material, the high glass-transition temperature ( T g ) of PDAP (about −10 to 8 °C) seriously affects the reliability of its storage and application in a wide temperature range for SRMs. Therefore, reducing the T g value of PDAP is a concern of optimization research for extending its application. Wang et al tried to reduce the T g value of poly­(bisphenoxy)­phosphazene by introducing different ratios of the ethoxy substituents, while predicting the T gs and establishing the relationships among synthesis, structure, and T g based on simulations. Similarly, the introduction of n -butoxy side groups can effectively reduce the T g value of PDAP, and the higher yield residual carbon of poly­(butoxy/aryloxy)­phosphazene (PBPP) gives it the potential to become an ablative substrate .…”
Section: Introductionmentioning
confidence: 99%