2004
DOI: 10.1016/j.jcrysgro.2003.12.015
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Effect of SeS2 treatment on the surface modification of GaAs and adhesive wafer bonding of GaAs with Silicon

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Cited by 4 publications
(3 citation statements)
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“…Two dominant diffraction peaks are found at 2θ angles of 27.30°a nd 45.41°without considering the substrate peaks, where these two peaks are corresponded to the cubic zincblende (ZB) GaAs ( 111) and (220) planes. 34 At the same time, HRTEM and EDS mapping are also performed on the obtained NWs as shown in Figure 3. Explicitly, a hemispherical Au-based catalytic seed is seen at the tip of the NW (Figure 3a), which implies the VLS growth mechanism of the GaAs NW.…”
Section: Resultsmentioning
confidence: 99%
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“…Two dominant diffraction peaks are found at 2θ angles of 27.30°a nd 45.41°without considering the substrate peaks, where these two peaks are corresponded to the cubic zincblende (ZB) GaAs ( 111) and (220) planes. 34 At the same time, HRTEM and EDS mapping are also performed on the obtained NWs as shown in Figure 3. Explicitly, a hemispherical Au-based catalytic seed is seen at the tip of the NW (Figure 3a), which implies the VLS growth mechanism of the GaAs NW.…”
Section: Resultsmentioning
confidence: 99%
“…To further explore the crystallinity of obtained NWs, XRD is performed as shown in Figure d. Two dominant diffraction peaks are found at 2θ angles of 27.30° and 45.41° without considering the substrate peaks, where these two peaks are corresponded to the cubic zincblende (ZB) GaAs (111) and (220) planes …”
Section: Resultsmentioning
confidence: 99%
“…[168] и с тех пор продолжает широко применяться для модификации характеристик различных оптоэлектронных и электронных приборов, в том числе светодиодов и лазеров [169,170], фотоприемников [21,[171][172][173][174], биполярных и полевых транзисторов [168,[175][176][177], а также наноструктур [178][179][180]. Данная обработка может использоваться и для модификации электронных свойств интерфейсов полупроводник/диэлектрик [20,28,181,182], a также для последующей модификации интерфейсов полупроводника с органической молекулой [151] [190][191][192][193], а также раствор S 2 Cl 2 в CCl 4 (наряду с чистым S 2 Cl 2 ) [194][195][196]. Было также показано, что обработка поверхности n-GaAs(100) раствором S 2 Cl 2 в CCl 4 приводила к заметному снижению плотности ПС и уменьшению приповерхностного изгиба зон, а также к формированию дипольного слоя, обусловленного связями Ga−S [197].…”
Section: методы модификации поверхностиunclassified