2018
DOI: 10.1109/jphotov.2018.2790700
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Effect of Series Resistances on Conversion Efficiency of GaAs/Si Tandem Solar Cells With Areal Current-Matching Technique

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Cited by 11 publications
(8 citation statements)
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“…Regarding the methods to construct III–V-on-Si architectures, a variety of studies have been reported. One of the most straightforward approaches would be the heteroepitaxial growth of GaAs-relevant materials on c-Si substrates; , however, despite the progress of elaborative buffer layer techniques to compensate for the difference in lattice constants and thermal expansion coefficients between GaAs and Si, the layer quality achieved with this type of approach remains a challenge. , Alternatively, bonding-based approaches have gained increasing attention, and as previously mentioned, impressive results have already been obtained by mechanically stacked four-terminal tandems and surface-activation-bonded two-terminal tandems. , We have also developed a unique semiconductor bonding strategy, termed smart stack. Using well-organized Pd nanoparticle (NP) arrays as bonding mediators, series-connected two-terminal tandem cells consisting of III–V and c-Si subcells have been successfully fabricated with the best efficiency of 30.8% . To make the smart stack technique more attractive, however, it would be preferable to find alternative materials for costly Pd, whose price has recently been rising due to the increasing demand of many other industrial applications…”
Section: Introductionmentioning
confidence: 99%
“…Regarding the methods to construct III–V-on-Si architectures, a variety of studies have been reported. One of the most straightforward approaches would be the heteroepitaxial growth of GaAs-relevant materials on c-Si substrates; , however, despite the progress of elaborative buffer layer techniques to compensate for the difference in lattice constants and thermal expansion coefficients between GaAs and Si, the layer quality achieved with this type of approach remains a challenge. , Alternatively, bonding-based approaches have gained increasing attention, and as previously mentioned, impressive results have already been obtained by mechanically stacked four-terminal tandems and surface-activation-bonded two-terminal tandems. , We have also developed a unique semiconductor bonding strategy, termed smart stack. Using well-organized Pd nanoparticle (NP) arrays as bonding mediators, series-connected two-terminal tandem cells consisting of III–V and c-Si subcells have been successfully fabricated with the best efficiency of 30.8% . To make the smart stack technique more attractive, however, it would be preferable to find alternative materials for costly Pd, whose price has recently been rising due to the increasing demand of many other industrial applications…”
Section: Introductionmentioning
confidence: 99%
“…Thus, the photocurrent of the CIGSe bottom cell improved in the previous structures. Furthermore, the ACM technique 57,58 was adapted to reduce the current mismatching degree in a tandem structure. Thus, in this study, the photocurrent of the CIGSe bottom cell was observed to be slightly smaller than that of the InGaP/GaAs upper cell.…”
Section: Device Designmentioning
confidence: 99%
“…Nevertheless, the two-terminal configuration has the advantages of an essentially low optical loss and a simple fabrication process, but the performance is easily affected by current mismatching. In this case, the ACM technique 57,58 is useful for obtaining pseudo-current matching by changing the area of each cell, maintaining a two-terminal configuration. Designing an appropriate area ratio between the two cells would maximize the efficiency.…”
Section: Analysis Of Acm Techniquementioning
confidence: 99%
“…Since upper cell materials with suitable bandgap are of critical importance for multi-junction TSCs, numerous semiconductors have been deeply studied, including III-V and II-VI compounds, organic/inorganic perovskite materials, etc. [7][8][9].…”
Section: Introductionmentioning
confidence: 99%