Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Abstract

A need for higher packaging density and functionality has increased the use of new packaging technologies, which has also caused demand for higher interconnect densities on printed circuit boards (PCBs). Sequential build-up (SBU) processes can be used to meet these demands. In the SBU process, additional dielectric and conductor layers are formed on a core board, which is typically made of FR-4. Microvias are formed on these layers to achieve an electrical connection between them and the core board. Resin-coated copper foil (RCC) is the most widely used dielectric layer in the SBU process. The effect of RCC on the reliability of flip chip joints with anisotropically conductive adhesive film (ACF) was studied. Two substrates were used. The difference between the substrates was RCC laminated on the other substrate. The reliability of the test samples was studied using a temperature cycling test and a constant humidity test. The reliability of the substrate with the RCC was found to be better in both tests. Failure mechanisms were studied after the tests, using optical and scanning electron microscopes. After the temperature cycling, several of the test samples made with two highest bonding pressures showed delamination, which has probably caused the failures. In addition, failures occurred during the changes in the test temperature. These were probably caused by warping of the flip chip package. No delamination was found in the test samples with the lowest pressure. The failures in these series were probably caused by relaxation of the adhesive matrix and by too low deformation of the conductive particles. Several cracks had formed on the FR-4 substrates without the RCC during the temperature cycling. In addition, air bubbles were found in the test samples with the FR-4 substrates without the RCC. Since RCC is a pure resin system, it has a high coefficient of thermal expansion, which may cause problems, especially when large components are attached to it. However, in this study, the RCC was found to increase the reliability of the flip chip joints made with ACF during both temperature cycling and constant humidity testing.

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

“…The contact area of the particles was reduced and the contact resistance increased (Frisk and Kokko, 2007). Water also penetrated the interface between the adhesive and the chip causing delamination and failures (Frisk and Kokko, 2007). According to this study conformal coating did not affect the failure mechanism.…”

“…During the constant humidity test, Figure 2 All the test samples failed after 2,000 h of constant humidity testing in Test series A 6,000 5,000 4,000 3,000 Note: Four test samples were tested from both test series humidity permeated the epoxy-based adhesive matrix causing it to swell. The contact area of the particles was reduced and the contact resistance increased (Frisk and Kokko, 2007).…”

Reliability of ACF Interconnections on FR-4 Substrates

“…Again, the reason for failures in the test samples with ACF2 and substrate100 is assumed to be relaxation. A more detailed description of failure analysis is given in [10], [17], [18].…”

“…This is most likely due to the pliability of the RCC [10]. As the RCC deforms more than FR-4 under the pads, higher pressure is needed to deform the conductive particles than for substrates without the RCC.…”

Reliability of adhesive joined thinned chips on flexible substrates under humid conditions

“…Bonding time and temperature were chosen according to the ACF manufacturer's recommendation and results from earlier studies with the same materials [18][19][20]. A bonding pressure of 110 MPa was chosen, since it had been found to give good results for the same adhesive in other studies.…”