Reliability of adhesive joined thinned chips on flexible substrates under humid conditions

Frisk, Laura; Saarinen-Pulli, Kirsi

doi:10.1016/j.microrel.2014.07.157

Cited by 6 publications

(1 citation statement)

References 31 publications

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“…The working environment of TIMs is consistent with that of chips. They face high-frequency vibration [ 18 ], thermal cycling [ 19 ], thermal shock [ 20 ], and high-humidity conditions [ 21 ], which can cause cracks, deformation, and other defects in TIMs, resulting in reduced heat dissipation efficiency and a decreased service life of chips. The optimal operating temperature of a chip is 70–80 °C, and a chip’s reliability decreases by 50% for every 10 °C increase in the temperature of a single electronic component [ 22 ].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Property Evolution of Diamond/GaInSn Composites under Thermal Load and High Humidity

Du,

Guo,

Zhang

et al. 2024

Materials

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As a thermal interface material, diamond/GaInSn composites have wide-ranging application prospects in the thermal management of chips. However, studies on systematic reliability that can guide the practical application of diamond/GaInSn in the high-temperature, high-temperature impact, or high-humidity service environments that are faced by chips remain lacking. In this study, the performance evolution of diamond/GaInSn was studied under high-temperature storage (150 °C), high- and low-temperature cycling (−50 °C to 125 °C), and high temperature and high humidity (85 °C and 85% humidity). The experimental results reveal the failure mechanism of semi-solid composites during high temperature oxidation. It is revealed that core oxidation is the key to the degradation of liquid metal composites’ properties under high-temperature storage and high- and low-temperature cycling conditions. Under the conditions of high temperature and high humidity, the failure of Ga-based liquid metal and its composite materials is significant. Therefore, the material should avoid high-temperature and high-humidity environments.

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