Effect of raw-Si particle size on the properties of sintered reaction-bonded silicon nitride

“…They attributed the possible reason to the particle size, based on the formation of the α‐phase by a gas‐phase reaction, because the evaporation rate of Si increases as the specific surface area increases. Similar results were reported by Lee et al 11,13 . In their work, the Si powders revealed a difference in the native oxygen content because of the particle size, but showed the same levels of metallic impurities.…”

Section: Resultsmentioning

confidence: 99%

“…Particularly, the coarse powder led to better mechanical properties of SRBSN than the fine powder. Furthermore, Lee et al 13 . used the coarser Si powder with an average particle size ( d 50 ) up to 25 μm to obtain successfully dense SRBSN materials that exhibited mechanical properties comparable with those prepared from the finer powders.…”

Section: Introductionmentioning

confidence: 99%

“…The desire for costeffective dense Si 3 N 4 components has led to the research and development of sintered reaction-bonded silicon nitride (SRBSN). [3][4][5][6][7][8][9][10][11][12][13] Compared with the direct sintering of Si 3 N 4 -powder compacts (SSN), SRBSN offers more possibility of reducing production costs of Si 3 N 4 components because of the combina-tion of the cheaper Si raw powder, the 60% weight gains from silicon nitridation, machinability of reaction-bonded silicon nitride (RBSN) body, and lower sintering shrinkage. SRBSN is typically produced by a two-step process: nitridation and postsintering.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Zhu

Zhou

Hirao

et al. 2006

Journal of the American Ceramic Society

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This paper will present sintered reaction‐bonded silicon nitride (SRBSN) material with a high thermal conductivity of 121 W·(m·K)−1, which has been successfully prepared from a coarse Si powder with lower levels of oxygen and aluminum impurities, using a mixture of Y2O3 and MgSiN2 as sintering additives, by nitriding at 1400°C for 8 h and subsequent post‐sintering at 1900°C for 12 h at a nitrogen pressure of 1 MPa N2. This thermal conductivity value is higher than that of the materials prepared from high‐purity α‐Si3N4 powder (UBE SN‐E10) with the same additive composition under the same sintering conditions. In order to study the effects of Si powder characteristics on the processing, microstructure, and thermal conductivity of SRBSN, the other type of fine powder with higher native oxygen and metallic impurity (typically Al and Fe) contents was also used. The effects of Si particle size, native oxygen, and metallic impurities on the nitriding process, post‐sintering process, and thermal conductivity of the resultant SRBSN materials were discussed in detail. This work demonstrates that the improvement in thermal conductivity of SRBSN could be achieved by using higher purity coarse Si powder with lower levels of oxygen and aluminum impurities. In addition, this work also shows that the nitriding temperature has no significant effect on the microstructure and thermal conductivity of SRBSN during post‐sintering, although it does affect the characteristics of RBSN formed during nitridation.

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“…Figure 1 shows the crystal structure of silicon nitride, where silicon atoms (black) and nitrogen (green) form hexagonal crystal structures [8]. In this study, silicon direct nitridation method was employed to fabricate Si3N4 ceramic material by placing Si powder under the gasses mixture of argon and nitrogen or ammonia [9][10][11][12][13][14][15][16][17][18][19][20]. The effect of the reaction conditions are assessed and optimized.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of Silicon Nitride Ceramic Material using Direct Nitridation Process

Tran¹,

La²

2018

IJAERS

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Effect of raw-Si particle size on the properties of sintered reaction-bonded silicon nitride

Cited by 34 publications

References 23 publications

Characterization of porous silicon nitride ceramics by pressureless sintering using fly ash cenosphere as a pore-forming agent

Characterization of porous silicon nitride ceramics by pressureless sintering using fly ash cenosphere as a pore-forming agent

Processing and Thermal Conductivity of Sintered Reaction‐Bonded Silicon Nitride. I: Effect of Si Powder Characteristics

Synthesis of Silicon Nitride Ceramic Material using Direct Nitridation Process

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