2008
DOI: 10.1007/s12221-008-0117-y
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Effect of processing conditions on warpage of film insert molded parts

Abstract: In order to investigate effects of injection molding conditions on viscoelastic behavior and thermal deformation of film insert molded (FIM) parts, injection molding was performed with various conditions such as injection speed, melt temperature, and packing time. It was shown that variation of the warpage was decreased monotonically with increasing injection speed and exhibited a bell-shaped curve as a function of melt temperature. Warpage variation was not affected by the packing time significantly and the p… Show more

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Cited by 33 publications
(7 citation statements)
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References 24 publications
(21 reference statements)
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“…This in turn leads to greater shrinkage of the polymeric materials and warpages of the molded part. However, the warpage increases again as the melt temperature is above 275 8 C. This matches with the results of Baek et al (2008) with a \ bell-shaped" tendency of part warpage. This can be explained by the fact that ah igher melt temperature keeps the polymeric melt hot for alonger time.…”
Section: Numerical Simulation Of Temperature and Part Warpagesupporting
confidence: 88%
See 1 more Smart Citation
“…This in turn leads to greater shrinkage of the polymeric materials and warpages of the molded part. However, the warpage increases again as the melt temperature is above 275 8 C. This matches with the results of Baek et al (2008) with a \ bell-shaped" tendency of part warpage. This can be explained by the fact that ah igher melt temperature keeps the polymeric melt hot for alonger time.…”
Section: Numerical Simulation Of Temperature and Part Warpagesupporting
confidence: 88%
“…The research efforts on IMD molded warpage, however, have been limited. Baek et al (2008) studied the effect of processing conditions on the warpage of the film insert's molded parts. They found that the warpage decreased monotonically with increasing injection speed and exhibited ab ell-shaped curve as af unction of melt temperature.…”
Section: Introductionmentioning
confidence: 99%
“…It is assumed that the occurrence of the blisters is related to the shrinkage of the substrate material. If the shrinkage in the substrate is higher than the contraction of the film insert during the cooling phase of the process, a delamination between the film insert and the substrate material can occur [23]. For that reason, the average volumetric shrinkage of the substrate under the film insert was investigated in the simulations.…”
Section: Simulationsmentioning
confidence: 99%
“…We confirmed that the warpage was exacerbated when glass fiber was added and experiments were conducted in an attempt to improve the warpage of the specimen by utilizing the MCP. In a previous investigation on warpage, Baek and Lee [16] studied the warpage characteristics of film insert molded parts according to the injection molding process conditions. Their research investigated warpage characteristics according to process conditions such as temperature, speed, and pressure, and it corresponds to insert injection process without the MCP.…”
Section: Introductionmentioning
confidence: 99%