2008
DOI: 10.1109/tnano.2008.926347
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Effect of Process Variation on Field Emission Characteristics in Surface-Conduction Electron Emitters

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Cited by 10 publications
(1 citation statement)
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“…As a kind of electron emission source based on field emissions, it has various potential applications, such as field emission displays (FEDs) [2][3][4][5], field emission lamps [6][7][8], small x-ray sources [9,10], and electric power switching devices [11,12]. It has been reported that several techniques can be used to create nanoscale fissures on conductive film, such as the focused ion beam (FIB) technique [13], palladium hydrogenation [14], the thermal shock process [15], and the electroforming process [16][17][18]. Among these techniques, the electroforming process is the simplest and most practical method, and has been adopted by Canon Inc. During the electroforming process, nanoscale fissures form due to a joule heat concentration caused by an electric current flowing through conductive film.…”
Section: Introductionmentioning
confidence: 99%
“…As a kind of electron emission source based on field emissions, it has various potential applications, such as field emission displays (FEDs) [2][3][4][5], field emission lamps [6][7][8], small x-ray sources [9,10], and electric power switching devices [11,12]. It has been reported that several techniques can be used to create nanoscale fissures on conductive film, such as the focused ion beam (FIB) technique [13], palladium hydrogenation [14], the thermal shock process [15], and the electroforming process [16][17][18]. Among these techniques, the electroforming process is the simplest and most practical method, and has been adopted by Canon Inc. During the electroforming process, nanoscale fissures form due to a joule heat concentration caused by an electric current flowing through conductive film.…”
Section: Introductionmentioning
confidence: 99%