Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints

Liu, Yang; Ren, Boqiao; Zhou, Min; Xue, Yuxiong; Zeng, Xianghua; Sun, Fenglian; Fan, Xuejun; Zhang, Guoqi

doi:10.1007/s00339-020-03926-3

Cited by 7 publications

(1 citation statement)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The solder layer of TLPB must exhibit excellent wettability and low-melting temperature with bonding metallic substrates. Among the solders, SB with a 138°C (Mokhtari and Nishikawa, 2016) contains precipitated Bi, which creates numerous phase boundaries and acts as a secondary phase within the Sn matrix (Liu et al , 2020a; He et al , 2023; Chen et al , 2016). This effectively reinforces the Sn matrix.…”

Section: Introductionmentioning

confidence: 99%

Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere

Xiong,

He,

et al. 2023

SSMT

View full text Add to dashboard Cite

Purpose This paper aims to examine the effects of bonding temperature, bonding time, bonding pressure and the presence of a Pt catalyst on the bonding strength of Cu/SB/P-Cu/SB/Cu joints by transient liquid phase bonding (TLPB). Design/methodology/approach TLPB is promising to assemble die-attaching packaging for power devices. In this study, porous Cu (P-Cu) foil with a distinctive porous structure and Sn-58Bi solder (SB) serve as the bonding materials for TLPB under a formic acid atmosphere (FA). The high surface area of P-Cu enables efficient diffusion of the liquid phase of SB, stimulating the wetting, spreading and formation of intermetallic compounds (IMCs). Findings The higher bonding temperature decreased strength due to the coarsening of IMCs. The longer bonding time reduced the bonding strength owing to the coarsened Bi and thickened IMC. Applying optimal bonding pressure improved bonding strength, whereas excessive pressure caused damage. The presence of a Pt catalyst enhanced bonding efficiency and strength by facilitating reduction–oxidation reactions and oxide film removal. Originality/value Overall, this study demonstrates the feasibility of low-temperature TLPB for Cu/SB/P-Cu/SB/Cu joints and provides insights into optimizing bonding strength for the interconnecting materials in the applications of power devices.

show abstract

Section: Introductionmentioning

confidence: 99%