Effect of pore morphology on elastic, heat conduction and thermal shock fracture behaviors of porous ceramics

Lee, W.J.; Cho, Y.J.; Lee, Hyunseop; Park, I.M.; Park, Y.H.

doi:10.1016/j.proeng.2011.04.405

Cited by 11 publications

(5 citation statements)

References 9 publications

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“…Samples fired at 750°C are more porous (from 43 to 47%) than those fired at 500°C (from 33 to 43%), with the exception of samples tempered with fine limestone (Table 2), but the increase in porosity is not sufficient to reduce the magnitude of TRS as suggested by literature (MacKenzie, 1950;Wang, 1984;Lee et al, 2011). This is probably due to the very low sintering level and the flaky microstructure at both temperatures.…”

Section: The Effect Of Firing Temperaturementioning

confidence: 81%

Strength of kaolinite-based ceramics: Comparison between limestone- and quartz-tempered bodies

Allegretta

Eramo

Pinto

et al. 2015

Applied Clay Science

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Section: The Effect Of Firing Temperaturementioning

confidence: 81%

Strength of kaolinite-based ceramics: Comparison between limestone- and quartz-tempered bodies

Allegretta

Eramo

Pinto

et al. 2015

Applied Clay Science

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“…Lee and co-authors modeled and simulated different idealized porous microstructures using a random sequential adsorption algorithm and a three dimensional finite element method ( Figure 4) and found that the elastic properties can indeed be substantially influenced by their pore morphologies. 30 Recently, Krishtab and co-authors experimentally showed that the cohesive strength of liquid phase self-assembly (LPSA) low-k dielectrics could be improved by tailoring its pore structure. 31 The main advantage of LPSA over PECVD low-k dielectrics is the ability to suppress the coupling between pore size and porosity, and thereby separating their contribution to the film strengthening.…”

Section: Impact Of Porosity and Pore Morphology On Mechanical Stabilitymentioning

confidence: 99%

Mechanical Stability of Porous Low-k Dielectrics

Vanstreels

Baklanov

2014

ECS J. Solid State Sci. Technol.

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This paper reviews the mechanical and fracture properties of porous ultralow-k dielectrics with the focus on chip package interaction related issues. It is shown that the mechanical and fracture properties of porous ultralow-k dielectric films are closely linked with porosity, pore morphology, network structure and deposition technology, while their fracture properties are also sensitive to reactive species in the environment. The survivability of low-k dielectrics upon integration, package assembly and subsequent reliability tests is therefore a combination of their mechanical stability, fracture properties, the specific mechanical or thermo-mechanical load and environmental effects. For the past three decades, the semiconductor industry has been improving the performance of microelectronic devices and the functionality of advanced integrated circuits through the continuous scaling of integrated circuits and the maximization of transistor density.1 Consequently, this encourages the introduction of new materials, processes, chip designs, and packaging strategies into micro-/nano-electronic products. Among these material innovations are insulating materials with a dielectric constant (k) less than that of SiO 2 , so called low-k dielectrics. During the last 15 years, various materials and methods have been developed for fabricating low-k dielectric films, among which the plasma enhanced chemical vapor deposition (PECVD) technology of porous organosilicate glasses (OSG) is the most popular due to its better compatibility with the technological needs.2-5 The reduction in k for low-k dielectrics is being pursued through the introduction of controlled levels of porosity. However, finding a good low-k material has proven to be much more challenging than first expected due to a number of integration and reliability issues.1 Besides the need of being compatible with the different lithography, etching, stripping and cleaning processes that are used in state-of-the-art integration schemes, they must also have sufficient mechanical strength to withstand the high shear stresses as well as harsh chemical environments that are involved during the chemical mechanical polishing process without cohesive or adhesive failure occurring.6-8 On top of that, since low-k dielectrics exhibit intrinsic tensile stresses and have increased coefficients of thermal expansion compared to SiO 2 , thin film cracking and adhesion are serious thermal-mechanical reliability issues for low-k dielectric materials (Figure 1). 9,10 Thermo-mechanical deformation of the package during package assembly and subsequent reliability tests can induce large local stresses that can initiate and propagate cohesive and/or adhesive cracks in different back-end of line (BEOL) layers.11 Therefore, a careful characterization of the mechanical integrity of potential new low-k candidates is required to integrate these new materials and Cu interconnects and to assure reliability during chip packaging and under field conditions. In the microelectronics industry, the elas...

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“…Compared with the sample W, although the porosity of samples WS, WA, and WZ changed slightly, the plant‐like hierarchical pores divided the large pores, which led to an increase in the number of small‐pores and the diminution of the MPS, thus decreasing the TC 42,44 . Moreover the plant‐shaped porous structure retained by the sol‐impregnated WSP increased the pore wall area, increasing the solid phase conduction path and preventing the radiant heat transfer, thereby effectively decreasing the TC 45‐47 . The samples WZ exhibited a lower TC due to the formation of the zircon phase.…”

Section: Resultsmentioning

confidence: 98%

Microscopic regulation of plant morphological pores on mechanical properties of porous mullite materials

et al. 2020

Int J Applied Ceramic Tech

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Generally, a multilayer structure is present inside a walnut shell, and the residual structure of the walnut shell is retained after impregnation and firing. When the walnut shell is used as a pore‐forming agent, this structure helps in improving the mechanical and thermal insulation properties of the lightweight porous materials. In this study, porous mullite materials (PMMs) with plant morphological structure pores were prepared using a‐Al2O3 and silica powder as the raw materials with addition of sol‐impregnated walnut shell powder (WSP). The influence of sol type and firing temperature on the pore structure of the PMMs was analyzed, which affected the compressive strength and thermal conductivity. The plant morphological porous structure was observed in the samples after sol impregnation. After firing at different temperatures, the porous structure gradually contracted and supported the pores, improving the mechanical properties, while the complex porous structure increased the heat conduction path, thereby improving the insulation performance. Using WSP impregnated with silica‐sol and zirconia‐sol as pore‐forming agents, PMMs with higher compressive strength and relatively low thermal conductivity (TC) were prepared.

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Effect of pore morphology on elastic, heat conduction and thermal shock fracture behaviors of porous ceramics

Cited by 11 publications

References 9 publications

Strength of kaolinite-based ceramics: Comparison between limestone- and quartz-tempered bodies

Strength of kaolinite-based ceramics: Comparison between limestone- and quartz-tempered bodies

Mechanical Stability of Porous Low-k Dielectrics

Microscopic regulation of plant morphological pores on mechanical properties of porous mullite materials

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