Abstract:An Ar-10 vol%H 2 plasma was applied as a cleaning medium on UBMs (Under Bump Metallizations) to improve the bondability of solder balls prior to plasma reflow. Each UBM area comprised four layers deposited on a Si-wafer. Sequentially, the deposit comprised 0.4 mm of Al, 4 mm each of Ni and Cu, and 20 nm of Au from bottom to top of the metallization. Two compositions of lead-free solder balls (Sn-3.5 mass%Ag and Sn-3.5 mass%Ag-0.7 mass%Cu) and a lead containing one (Sn-37 mass%Pb) as a reference were selected f… Show more
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