2014 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK) 2014
DOI: 10.1109/imfedk.2014.6867065
|View full text |Cite
|
Sign up to set email alerts
|

Effect of passivation films on DC characteristics of AlGaN/GaN HEMT

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2017
2017
2022
2022

Publication Types

Select...
3
1
1

Relationship

0
5

Authors

Journals

citations
Cited by 6 publications
(1 citation statement)
references
References 4 publications
0
1
0
Order By: Relevance
“…To overcome this shortcoming, a hybrid high-k/low-k double passivation structure has been proposed in GaN HEMT devices. However, it should be noticed that the thickness of these two materials is critical for the device performance when used for improving the breakdown voltage of the devices [8,9]. Additionally, the double passivation layer structure-based devices are still difficult in achieving V BR over 1000 V with the average electric field up to 2 MV cm −1 simultaneously.…”
Section: Introductionmentioning
confidence: 99%
“…To overcome this shortcoming, a hybrid high-k/low-k double passivation structure has been proposed in GaN HEMT devices. However, it should be noticed that the thickness of these two materials is critical for the device performance when used for improving the breakdown voltage of the devices [8,9]. Additionally, the double passivation layer structure-based devices are still difficult in achieving V BR over 1000 V with the average electric field up to 2 MV cm −1 simultaneously.…”
Section: Introductionmentioning
confidence: 99%