Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys

Chavali, S.; Singh, Yuvraj; Subbarayan, Ganesh; Bansal, Anurag; Ahmad, Mudasir

doi:10.1016/j.microrel.2013.02.006

Cited by 6 publications

(3 citation statements)

References 20 publications

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“…It is quite difficult to control the phosphorus content in the Ni-P coating, so there will always be some variation during testing. The results were in the same argument with [2,16,17]. In this research, we selected to follow the general classification of Ni-P deposits; low (1-5 wt% P), medium (5-8 wt% P) and high (9 wt% P and more).…”

Section: Diffusion Barrier Layermentioning

confidence: 56%

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

Idris¹,

Ourdjini²,

Ariff³

et al. 2015

Int. J. CMEM

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In this paper, the nickel-phosphorus (Ni-P) diffusion barrier layer between Sn-4Ag-0.5Cu solder alloy and copper-printed circuit board was developed. The electroless plating technique was used to develop Ni-P diffusion barrier layer with different percentage of phosphorus content, which are 1-5 wt% (low), 5-8 wt% (medium) and above 8 wt% (high). The results reveal that the high phosphorus content in nickel layer acts as a good diffusion barrier for Sn-4Ag-0.5Cu since it can suppress the intermetallic compound formation. This is because in higher phosphorus content, the grain boundaries were found to be eliminated. Hence, resulted in thinner intermetallic compound thickness.

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Section: Diffusion Barrier Layermentioning

confidence: 56%

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

Idris¹,

Ourdjini²,

Ariff³

et al. 2015

Int. J. CMEM

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“…Kemasan Au dan OSP pula digunakan untuk melindungi permukaan pad daripada teroksida dan meningkatkan kebolehbasahan (Goncalves et al 2015). Maka kemasan permukaan didapati memainkan peranan yang penting dalam tindak balas antaramuka sambungan dan mempengaruhi mikrostruktur berhampiran pateri-substrat (Chavali et al 2013).…”

Section: Pengenalanunclassified

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

Bakar

Jalar²,

Ismail

2018

JSM

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“…Cooling rate is one of an important parameter in the solder reflow process that affects the microstructure of solder alloy as well as the morphology and growth of IMC formed between the solder and its metallization. Hence, affect the mechanical integrity of the joint [4][5][6]. Investigation by Ochoa et al [7] found that cooling rate significantly affected secondary dendrite-arm size and spacing of the Sn-rich phase.…”

Section: Introductionmentioning

confidence: 99%

Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

Kahar

Akhtar

Idris

et al. 2014

AMM

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This paper presents a study on relationship of cooling rates towards the intermetallic compound (IMC) morphology. Cooling rate is an important parameter as it has significant effect towards the IMC microstructure formation that indirectly affects solders joint reliability. However, there is still insufficient study regarding the effect of cooling rate on the IMC thickness and microstructure behavior by using Nickel Boron as surface finish material in the electronic packaging industry. In this study, Sn-3Ag-0.5Cu solder was used on Nickel Boron as coating layer. Cooling rates were obtained by cooling specimens in different media which is water and air. The elemental composition was confirmed using Energy-dispersive X-ray spectroscopy and the microstructure of each IMC then analyzed using optical microscope, image analyzer and ImageJ. In this study, faster cooling rate (water) found to provide thicker IMC (6μm) compared to the other medium used. The morphology shape of each IMC also differs between different medium of cooling. IMC that undergoes faster cooling showed continues like layer while the one using air cooling formed scallop like IMC.

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Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys

Cited by 6 publications

References 20 publications

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

Development of diffusion barrier layer on copper-printed circuit board using electroless plating method

Kesan Kemasan Permukaan Berbeza terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307 menggunakan Pendekatan Pelekukan Nano

Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating

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