Effect of oxygen content on wettability, microstructure and solderability of Au–20Sn solders

Wang, Liujue; Xue, Songbai; Han, Lei

doi:10.1007/s10854-018-0261-0

Cited by 6 publications

(5 citation statements)

References 19 publications

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“…e oxygen content of AuSn solder matrix was also claimed to affect its solderability. As it could be seen from Figure 5, the increasing oxygen content gave a lower spreading area, whether flux was applied or not [36].…”

Section: Mechanical Propertymentioning

confidence: 71%

“…Moreover, the oxygen content of the Au-Sn solder matrix was also found to be an adverse factor for the morphology and strength of interfacial layer. Wang et al [36] found that once the oxygen content exceeded 42 ppm, the oxygen would be entrapped in the Au-Sn/Cu solder joint during the soldering process and formed a number of voids, even a few cracks, which would deteriorate the property of solder joint. erefore, it is of great significance to focus on the storage condition of Au-Sn solder alloys.…”

Section: Interfacial Microstructurementioning

confidence: 99%

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Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Mechanical Propertymentioning

confidence: 71%

Section: Interfacial Microstructurementioning

confidence: 99%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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“…65) The formation of oxides on the solder surface will be promoted by the high oxygen content in Au20Sn solder, leading to porosity and cracks that can occur during reflow, thereby the reliability of the solder joint is decreased. 30) The Au 20Sn solder joints had good microstructure with the oxygen content level of 16 ppm. Cracks and holes appeared in the joints with the oxygen content of 55 ppm.…”

Section: Mechanical Propertiesmentioning

confidence: 96%

“…6. 30) As the oxygen content increases, the spreading area of the solder decreases. The spreading area of the solder is 96.5 mm 2 with the oxygen content of 16 ppm.…”

Section: Wettabilitymentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

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“…When the oxygen content increased to 77 ppm, the spreading area was 47% lower than that of the solder with 18 ppm of oxygen, only 49.2 mm 2 . Previous investigations have demonstrated that the oxygen at the surface of the Au-Sn solder exists mainly in the forms of SnO and SnO 2 [15]. On one hand, the oxide film at the surface of the liquid Au-Sn solder increases the surface tension and decreases the wetting and spreading tendency.…”

Section: Effect Of Oxygen Content On Wettability Of the Soldermentioning

confidence: 99%

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

Li¹,

Wu²,

Zhang³

et al. 2021

Crystals

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The Au-20Sn solder is widely used in the packaging of high-end electronic products, and the requirement on the reliability of the solder joints is more and more strict with a continuous increase in the performance of the package products. As the oxygen content in the Au-Sn solder is a key factor dominating the quality of fluxless packaging, in this study, the wettability and spreading performance of the Au-20Sn solder with different oxygen contents and the interfacial microstructure, mechanical properties, gas tightness and ratio of soldering area of the Au-Sn/Cu solder joints prepared using these solders were comprehensively investigated to clarify the effects of trace oxygen content. The results reveal that the wetting and spreading performances of the solder decrease sharply with increasing oxygen conte[nt. When the oxygen content increased from 18 to 77 ppm, the spreading area of the solder on the Cu substrate decreased from 92.8 to 49.2 mm2, reducing by 47%. Meanwhile, pores and microcracks appear in the solder joint with relatively high oxygen content, making the shear strength decrease from 56.6 to 31.7 MPa. The oxygen also greatly affects the gas tightness and ratio of soldering area. For the optical window packaged using Au-Sn solder containing 40 ppm of oxygen, the leakage rate was higher than 5 × 10−11 mbar·m−3·s−1 and cannot fulfill the requirements. With increasing oxygen content in the Au-Sn solder, the cleanliness of the chip packaged with these solders deteriorated, and the solder surface was obviously oxidized. When the oxygen content was 18 ppm, the ratio of soldering area was 92%, but decreased sharply to 53% when the oxygen content increased to 77 ppm. It is demonstrated that an oxygen content lower than 27 ppm is required for the Au-20Sn solder used in fluxless packaging.

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Effect of oxygen content on wettability, microstructure and solderability of Au–20Sn solders

Cited by 6 publications

References 19 publications

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Effects of Trace Oxygen Content on Microstructure and Performances of Au-20Sn/Cu Solder Joints

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