Effect of Ni addition on the Sn-0.3Ag-0.7Cu solder joints

Wang, Lingling; Sun, Fenglian; Liu, Yang; Wang, Lifeng

doi:10.1109/icept.2009.5270632

Cited by 7 publications

(1 citation statement)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Near-eutectic Sn-Ag-Cu (SAC) solder alloy is concerned to be the best replacement for lead-based solders in the electronic industry [9,10]. However, there are still some drawbacks such as the poor drop resistance and the high cost for the high Ag content in near-eutectic SAC solder.…”

Section: Introductionmentioning

confidence: 99%

Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test

Liu

Sun

Yang

2013

2013 14th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

This paper investigated the shear strength and failure mechanism of low-Ag SAC-BiNi solder joints in comparison with SAC0705 and SAC305 solder joints. Experimental results demonstrated that the shear strength of SAC0705-BiNi/Cu solder joint was higher than SAC0705/Cu and SAC305/Cu solder joints before and after HTS aging. Moreover, SAC0705-BiNi/Cu solder joint has the smallest IMC grains and the highest resistance for the spread of shear crack in the three kinds of solder joints after reflow. After HTS aging, the interfacial microstructure of the investigated solder joints coarsened and the shear strength of these solder joints decreased. In SAC0705/Cu and SAC305/Cu solder joints, the failure of the solder joints is due to the ductile fracture of the bulk solder of the solder joints and the brittle broken of the individual large IMC grains. Meanwhile, the failure of SAC0705-BiNi/Cu is mostly because of the broken of interfacial IMC and the separation between IMC and the bulk solder of the solder joins.

show abstract

Section: Introductionmentioning

confidence: 99%

Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test

Liu

Sun

Yang

2013

2013 14th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

show abstract

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Shnawah

Said

Sabri

et al. 2012

Journal of Elec Materi

View full text Add to dashboard Cite

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Cui

Zhang

Zhao

et al. 2021

Sci Rep

View full text Add to dashboard Cite

Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

show abstract

Effect of Ni addition on the Sn-0.3Ag-0.7Cu solder joints

Cited by 7 publications

References 7 publications

Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test

Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

Contact Info

Product

Resources

About