1966
DOI: 10.1149/1.2424091
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Effect of NH[sub 3] on Deposition from Alkaline Electroless Nickel and Cobalt Plating Baths

Abstract: The ammonia generally used as a buffer in alkaline electroless nickel and cobalt plating baths has been shown to have a significant effect on both the rate of deposition of thin metal films and the magnetic and physical properties of such films. These effects have been studied on both metallic and nonmetallic substrates, using both ammonia and nonammine buffer systems, and attempts have been made to correlate them with spectral and polarographic observations.

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Cited by 14 publications
(9 citation statements)
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“…To ensure a uniform initial surface, samples were wet-polished smooth using 240grit SiC emery paper and rinsed in distilled water. The alkaline deposition baths used for the electroless cladding of Ni-P, Tables II and 3, are similar to other conventional electroless Ni-P formulations [19][20][21][22] and contain only the ingredients listed.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…To ensure a uniform initial surface, samples were wet-polished smooth using 240grit SiC emery paper and rinsed in distilled water. The alkaline deposition baths used for the electroless cladding of Ni-P, Tables II and 3, are similar to other conventional electroless Ni-P formulations [19][20][21][22] and contain only the ingredients listed.…”
Section: Methodsmentioning
confidence: 99%
“…To ensure a uniform initial surface, samples were wet-polished smooth using 240grit SiC emery paper and rinsed in distilled water. The alkaline deposition baths used for the electroless cladding of Ni-P, Tables II and 3, are similar to other conventional electroless Ni-P formulations [19][20][21][22] and contain only the ingredients listed.In this paper, 'polished' samples designate those samples that were dry polished in open atmosphere using 240grit SiC emery paper immediately before deposition so as to minimize the formation of an oxide/hydroxide layer. The polishing was done such that minimal heating of the sample occurred in order to not further promote the formation of the insulating oxide layer.…”
mentioning
confidence: 99%
“…The accelerating effect of Co electroless deposition was formerly observed by Alberts et al [9]. Interestingly, after their conclusions, they made a final remark by saying that "New or modified techniques will have to be used to study the rate and magnetic variations caused by NH 3 and to improve the understanding of the deposition processes".…”
Section: Resultsmentioning
confidence: 89%
“…Many different additives such as acetate, lactate, citrate, succinate or glycolate were already tested for Co deposition [8], and ammonium salts are normally used as alkaline buffers [9]. Dimethylaminoborane (DMAB) is the most used reducing agent as it can be employed in both alkaline and acidic baths [8].…”
Section: Introductionmentioning
confidence: 99%
“…The deposition rate of alkaline electroless nickel baths relatively unaffected by bath pH within the normal range employed [31]. The baths are usually maintained at the proper pH by addition of ammonium hydroxide to replace evaporated ammonia and to neutralize acid produced by the deposition reaction.…”
Section: Effect Of Phmentioning
confidence: 99%