The Influence of Ammonia on the Electroless Deposition of CoB Alloys from Alkaline Citrate containing Baths

Ribeiro, Mauro C.; Frank, André C.; Sumodjo, Paulo Teng An

doi:10.1016/j.electacta.2014.10.009

Cited by 4 publications

(3 citation statements)

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“…The reactions proceed via multistep pathways involving 5coordinate BH 5−x (OH) x − (x = 2, 3, 4) intermediates: In addition, the reduction of B(OH) 4 − in solution occurs simultaneously with reduction of metal ion to metal to form elemental boron, 280 which is incorporated into the metal deposit:…”

Section: Acs Appliedmentioning

confidence: 99%

“…EL Co and its alloys are readily deposited using baths containing a variety of reducing agents, including H 2 PO 2 – , ,,− amine boranes, − BH 4 – , , N 2 H 4 , , and carbohydrates that affect mechanical, catalytic, and magnetic properties of the deposit. Like EL Fe, EL Co has been shown useful for the selective plating of TMV and CPMV templates for the fabrication of metal nanostructures ( vide supra , Iron section).…”

Section: Elementsmentioning

confidence: 99%

“…Boron incorporation is intimately tied to the complex oxidation chemistry of the DMAB or BH 4 – reductant. For DMAB, , initial hydrolysis in aqueous solution leads to formation of hydroxytrihydroborate anion (BH 3 OH – ): BH 3 OH – is then oxidized via efficient 6e – or less efficient 3e – reactions: The reactions proceed via multistep pathways involving 5-coordinate BH 5– x (OH) x – ( x = 2, 3, 4) intermediates: BH 3 OH – decomposition via chemical reaction with H 2 O also competes: In addition, the reduction of B(OH) 4 – in solution occurs simultaneously with reduction of metal ion to metal to form elemental boron, which is incorporated into the metal deposit: Similar reactions can be written for BH 4 – .…”

Section: Elementsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: Acs Appliedmentioning

confidence: 99%