Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

Microstructural Characteristics of Electro-Plated Cu Films by DC and Pulse Systems

“…전기전자부품용 구리박막은 기계적, 전기적, 열적 신뢰성 이 우수해야 하며 이러한 물성은 미세조직에 영향을 받 는다. 결정립 크기에 따라 강도 및 연성이 변화하며, 1,2) 결정방위 및 결정립계의 특성은 전기전도도, 부식 및 electromigration 특성에 영향을 미친다. [3][4][5] 연성인쇄회로 기판의 유연성(flexibility)을 결정하는 구리박막의 내굴곡 성(bending resistance)은 결정립 크기 및 결정립계의 특 성에 의해 변화한다.…”

Mechanical properties of Cu–Al–O thin films prepared by plasma-enhanced chemical vapor deposition

“…Figure 4͑a͒ illustrates the load-displacement curves of the film. 13 Such a high elastic recovery may be a manifestation of the relatively covalent nature of the bonding structure in the film. The reproducibility of the curves indicates that the film is homogenous and there is little contamination on the surface.…”

“…Ten tests were performed and these curves were reproducible within the accuracy of a small 2 nm drift. 14 Sikder et al 13 reported that a higher plasticity in a Cu film was due to the bonding change from covalent to metallic. Compared with metal films which usually exhibit considerable plastic deformation under an external force, the copper aluminium oxide film has a large elastic recovery, and the plastic deformation is small.…”

Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

“…Generally, structure and electrical qualities of films strongly depend on the deposition process [6]. On the other hand, the postprocessing such as annealing can also change the microstructure and mechanical properties of the films [7,8].…”