Effect of multiple reflow cycles on intermetallic compound creation

Wirth, Vaclav; Rendl, Karel; Steiner, František

doi:10.1109/isse.2015.7247995

Cited by 15 publications

(6 citation statements)

References 6 publications

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“…The results clearly indicate the greater resulting thickness after the secondary reflow for all of the surface finishes (see Figure 5). This is in full agreement with the research works on this topic [28][29][30]. From the overall point of view, the highest increase in the thickness of the intermetallic layer is evident in the HASL surface finish and the lowest in the OSP surface finish.…”

Section: Influence Of Several Reflowssupporting

confidence: 92%

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

et al. 2021

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Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

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Section: Influence Of Several Reflowssupporting

confidence: 92%

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

et al. 2021

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“…The higher heat flow during the soldering process ensures faster intermetallic compound formation. Long-term exposure to higher temperatures, such as repeated exposure to the soldering process, causes an increase in the thickness of the intermetallic layers [1,2]. The thickness mainly affects the mechanical strength of the joint, which results in a lower mechanical resistance after exceeding a certain IMC thickness [6,7].…”

Section: Theorymentioning

confidence: 99%

“…In this publication, its importance is solved from the point of view of the process of ball-attach process, or reballing process, on the BGA packages with focus on the research of the intermetallic layer, more precisely its thickness and roughness. The thickness and roughness of the intermetallic layer in the process of the ball-attach/reballing must be ensured as small as it can be because (Cu, Ni) 6 Sn 5 and (Ni, Cu) 3 Sn 4 increase with each further process of reflow [1,2]. After inadequate soldering of a BGA package on a PCB, the reliability of the resulting joint due to the thickness of the intermetallic layers can be reduced.…”

Section: Introductionmentioning

confidence: 99%

Influence of heat flow direction on solder ball interfacial layer

Otahal

Szendiuch

2018

Journal of Electrical Engineering

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This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were soldered by infrared heating. The heat sources were placed on the top, bottom and both lateral sides of the BGA package. After the solder balls-attach process, a metallographic cross-section was performed, followed by selective etching to visualize the relief of the intermetallic layer. Images of the interfacial between the solder and solder pad were taken from the created samples, followed by measurement of the average thickness and root mean square roughness of the intermetallic layer. The results showed changes in the intermetallic layer. The largest thickness of the intermetallic layer was observed on samples soldered from the top and both sides. Soldering with the bottom infrared heater resulted to the smallest thickness of the intermetallic layer. The same trend was in the roughness of the IMC layer. The greatest roughness was found for samples soldered by the top and both side heaters. The top soldered samples exhibit the smallest roughness.

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“…Wettability can also be affected by IMCs, for example, during solder joint rework. The thickness of these compounds increases with time and temperature (Wassink, 1989;Wirth et al, 2015;Krammer, 2014;Dušek and Tučan, 2008;Kahar et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Optimization of solder paste quantity considering the properties of solder joints

Hirman

Steiner

2017

SSMT

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Purpose The purpose of this paper is to find an optimum between the quantity of solder paste and the desired properties of the soldered joint. A reduction of solder paste quantity is recognized as an opportunity to save money. On the other hand, the quantity of solder paste significantly influences the final properties of the soldered joint. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach The processing of the paper was initiated by a literature review. The expert analysis was the next step. The result of analysis was a fishbone diagram. Subsequently, the experiment was designed. Seven types and three volume of solder pastes and two aperture shapes of the stencil were used. The measured parameters were mechanical strength, electrical resistance, voids area and intermetallic compound (IMC) thicknesses. The results of the experiment were evaluated and recommendations for practice were defined. Findings The carried out research has confirmed the influence of solder paste quantity on the shear strength, electrical resistance, voids area and IMC thickness of solder joint. The article presents the results achieved for solders Sn42Bi58, Sn42Bi57.6Ag0.4, SnAg3.0Cu0.5, SnCu0.7Ag1.0NiGe, SnAg3.5Bi0.5In8.0 and Sn62.5Pb36.5Ag1.0. Reduction of solder paste quantity down to 74 per cent (i.e. one quarter of quantity) decreases mechanical shear strength less than 10 per cent. Recommendations relating to the optimal reduction of solder paste quantity have been designed for each solder paste. Originality/value Contribution of the paper is impact assessment of solder paste quantity on the properties of the soldered joint. It was carried out a large number of experiments and measurements which verify this effect. Such a comprehensive overview of the results is not yet available in the literature. Recommendations for manufacturers of electronic assemblies are also the benefit of article.

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Effect of multiple reflow cycles on intermetallic compound creation

Cited by 15 publications

References 6 publications

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Influence of heat flow direction on solder ball interfacial layer

Optimization of solder paste quantity considering the properties of solder joints

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