Effect of multiple reflow cycles on ball impact responses of Sn‐Ag‐Cu solder joints

Abstract

PurposeThe purpose of this paper is to report the effect of multiple reflow cycles on ball impact test (BIT) responses and fractographies obtained at an impact velocity of 500 mm/s on Sn‐4Ag‐0.5Cu solder joints.Design/methodology/approachSolder balls were mounted on copper substrate pads with immersion tin surface finish, supplied by two vendors. For these particular test vehicles and test conditions, fracture near the interface between the interfacial Cu6Sn5 intermetallic compound (IMC) and copper pad was identified as the only failure mode induced by BIT.FindingsMeasurement results indicate that BIT characteristics in general degrade as the number of reflow cycles increases. Furthermore, scanning electron microscopy observations show that the thickness and grain size of interfacial Cu6Sn5 increase with increasing number of reflow cycles. This correlation confirms the familiar notion that a thicker Cu6Sn5 degrades the interfacial strength.Originality/valueThere are few reports that can attribute failure directly to the IMC(s) at the interface. This paper, however, successfully correlates the weakening solder joints with the thickening and shape changes of IMC(s) in a direct way.

Simulation for Cu Atom Diffusion Leading to Fluctuations in Solder Properties and Cu6Sn5 Growth during Multiple Reflows

“…Through the development of technology, the assembly density of packaging bodies is increasing, and the packaging process is becoming increasingly complex. It is difficult to complete the entire structure of the encapsulation process through a single reflow [1,2]. Three-dimensional electronic packages, characterized by the miniaturization of electronic products, generally require multiple reflows to complete their interconnection needs [3][4][5].…”