Effect of Molecular Weight on Processing and Adhesive Properties of the Phenylethynyl-Terminated Polyimide LARC™-PETI-5

Cano, Roberto J.; Jensen, Brian J.

doi:10.1080/00218469708014413

Cited by 44 publications

(27 citation statements)

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“…26 As shown in Table 3, for example, as a result of the phenylethynyl group reaction, the T g of Oligo-1 had an obvious growth from 155 C to 326 C. All of the other oligomers displayed similar thermal behavior, and the T g s of the cured oligomers decrease correspondingly from 326 C to 280 C with the increasing of M n , which could be attributed to the cross-linking density. 19,36 All the films exhibited higher T g values than PETI-5 (270 C), 17 which indicated that these oligomers could be used at higher temperature.…”

Section: Thermal Properties Of the Oligomers And Thermally Cured Filmsmentioning

confidence: 97%

“…29,34,35 Furthermore, decreasing the molecular weights of the oligomers led to an apparent drop in the minimum melt viscosity, and at the same time, it provided a broader processing window as expected. 17,26,33 Isothermal viscosity measurements at 280 C were also conducted to test the melt stability. Figure 5 shows the melt viscosities of oligomers at 280 C for 1 h and Table 2 summaries the isothermal melt viscosity data of the aromatic …”

Section: Melt Processability Of Phenylethynly-terminated Oligomersmentioning

confidence: 99%

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Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Sun

Wang

et al. 2016

High Performance Polymers

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A series of oligomers based on the mixture of thioetherdiphthalic anhydride isomers and 4,4 0 -oxydianiline with 4-phenylethynylphthalic anhydride as reactive endcapping reagent were prepared. The calculated molecular weights were in the range of 1150-5070 g mol À1 with different degrees of polymerization (n ¼ 1, 3, 5, 7, and 9). The effect of molecular weight of the aromatic oligomers on their processability and solubility as well as the thermal and mechanical properties of the thermal-cured polyimides (PIs) was systematically investigated. The typical oligomer (Oligo-1) could be melted at temperatures of 289-334 C to yield stable molten fluid with melt viscosity below 1.0 Pa s. The melt viscosity of the oligomers increased with the increasing molecular weight. After thermally curing at 370 C, the thermoset PIs exhibited good thermal properties. The glass transition temperatures of oligomers measured by differential scanning calorimetry were in the range of 286-326 C, and the temperature of 5% weight loss was higher than 524 C. The cured films also showed good mechanical properties with tensile strength above 72 MPa and modulus more than 2.5 GPa.

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Section: Thermal Properties Of the Oligomers And Thermally Cured Filmsmentioning

confidence: 97%

Section: Melt Processability Of Phenylethynly-terminated Oligomersmentioning

confidence: 99%

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Sun

Wang

et al. 2016

High Performance Polymers

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“…This material has a unique combination of properties including superior mechanical properties and thermal stability, excellent resistance to aircraft fluids, and easy processing in an au- toclave. To date, a composite system, PETI-5 reinforced with IM7 graphite fiber, has displayed promising performance, meeting the requirements of the HSCT program [2][3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Tensile and Fracture Characterization of PETI-5 and IM7/PETI-5 Graphite/Epoxy Composites Under Quasi-Static and Dynamic Loading Conditions

Lee

Tippur

Jensen

et al. 2011

Journal of Engineering Materials and Technology

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Tensile and fracture responses of the phenytethynyl terminated imide oligomer are .studied. Since this polymer is a candidate aerospace structural adhesive as well as a matrix material in composite systems, neat as well as fiber reinforced forms of PETI-5 are studied under static and dynamic loading conditions. A split-Hopkinson tension bar apparatus is used for performing tensile tests on dogbone specimens. The dynamic fracture tests are carried out using a drop tower in conjunction with 2D image correlation method and high-speed digital photography on edge cracked specimens in three-point bend configuration. A toughened neat epoxy system, Hexcel 3900, is also studied to provide a baseline comparison for neat PETI-5 system. The tensile stress-strain responses show PETI-5 to have excellent mechanical characteristics under quasi-static and dynamic loading conditions when compared with 3900. Eracture behavior of PETI-5 under quasi-static and impact loading conditions also shows superiority relative to 3900. The dynamic fracture behavior of a PETI-5 based graphite fiber reinforced composite, IM7/ PETI-5, is al.w studied and the results are comparatively evaluated relative to the ones corresponding to a more common aerospace composite system, T800/3900-2 graphite/ epoxy. Once again, the IM7/PETI-5 system shows excellent fracture performance in terms of dynamic crack initiation and growth behaviors.

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“…The extent of imidization can be determined from the heights of the absorption bands for imides I and III, terminated imide oligomers for high-temperature aerospace and aircraft applications, known as phenylethynyl-terminated imide (LaRC PETI), were developed at the National Aeronautics and Space Administration (NASA) Langley Research Center, USA [13][14][15][16][17][18][19]. These materials have broader processing windows and thermal oxidative stability than simple ethynyl-terminated materials, and consequently have many practical advantages as a potential material for coatings, adhesives, films, and composite matrix resins [20,21].…”

Section: Phenylethynyl-terminated Imide Polymermentioning

confidence: 99%

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Cho

Drzal²

2016

Carbon letters

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In efforts to characterize and understand the properties and processing of phenylethynylterminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.Key words: polyimide, exfoliated graphite nanoplatelets, carbon fiber, composite, properties Phenylethynyl-Terminated Imide PolymerPolyimides have been extensively used in the electronics industry [1] as coatings, films, or adhesives and also in composite applications [2] as a primary or secondary structural material. When incorporated with organic or inorganic fibers, including carbon fibers and glass fibers, they can potentially be applied as a sizing material for high-temperature uses. In advanced applications, one of the most desirable advantages of polyimides, especially the aromatic polyimides, is their excellent high-temperature performance. Their thermal characteristics, including high temperature stability and cure behavior, are critical to successful processing and to the final properties of the resulting polyimide. For aerospace and aircraft applications, advanced polymer materials must successfully maintain their properties at high service temperatures over a long exposure time [3][4][5].The important parameters influencing the heat resistance of a polymeric material are its glass transition temperature (T g ), melting point (T m ), thermal stability, and etc., which may depend on its thermal history. Accordingly, polymers that are used to fulfill such high temperature performance should exhibit a high T g or T m and have excellent thermal stability. Even though some polyimides meet the high temperature requirement, their uses have been limited due to processing difficulties, such as poor solubility in common solvents, the release of volatiles, brittleness, and high processing temperature [6,7].Aromatic polyimides, especially acetylene or ethynyl-terminated polyimides, have been extensiv...

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Effect of Molecular Weight on Processing and Adhesive Properties of the Phenylethynyl-Terminated Polyimide LARC™-PETI-5

Cited by 44 publications

References 2 publications

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Phenylethynyl-terminated imide oligomers derived from thioetherdiphthalic anhydride isomers with decreased melt viscosities

Tensile and Fracture Characterization of PETI-5 and IM7/PETI-5 Graphite/Epoxy Composites Under Quasi-Static and Dynamic Loading Conditions

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

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