Effect of molecular resist structure on glass transition temperature and lithographic performance in epoxide functionalized negative tone resists

Narcross, Hannah; Lawson, Richard A.; Sharp, Brandon; Chun, Jun Sung; Neisser, Mark; Tolbert, Laren M.; Henderson, Clifford L.

doi:10.1117/12.2086027

Cited by 4 publications

(1 citation statement)

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“…Different photoresists are matched with different baking process parameters, and sometimes different baking parameters can be applied to the same polymer-based photoresist. It is reported that the glass transition temperatures of some epoxide-based negative-tone molecular glass photoresists are generally lower than 100°C [ 36 – 38 ], while the glass transition temperature of BPA-6OH negative photoresist is much higher. This high glass transition temperature can meet the requirement of the lithographic processes.…”

Section: Resultsmentioning

confidence: 99%

Negative-tone molecular glass photoresist for high-resolution electron beam lithography

Chen

Guo

et al. 2021

R. Soc. open sci.

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A low molecular weight organic compound containing bis-phenol A backbone (BPA-6OH) is reported as a negative-tone photoresist. This material has a high glass transition temperature and excellent thermal stability. A good contrast, well-resolved line pattern around 73.4 nm and sensitivity of 52 µC cm −2 can be received for negative-tone molecular glass photoresist upon exposure in electron beam lithography system. It indicates that the negative-tone molecular glass photoresist is one of the promising candidates for use in electron beam lithography.

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Section: Resultsmentioning

confidence: 99%