“…Recently, there is a considerable interest in lowering the sintering temperatures of dielectric ceramics for co-firing with cheaper and highly conductive internal electrode metals such as Ag (the melting point 961 • C) and Cu (the melting point 1050 • C) [7,8], however, the sintering temperatures of most of commercial microwave dielectric ceramics are usually above 1300 • C. In order to reduce the sintering temperature of dielectric ceramics, there are several methods commonly explored [9]: (1) the addition of low melting point compounds or glass-forming additives to reduce the sintering temperature of commercially developed dielectric ceramics, however, in many cases, the additions produce a significant deterioration in Q × f values, (2) the chemical processing and smaller particle size of starting materials by the sol-gel and coprecipitation methods, and (3) a study of new series of dielectric ceramics with low sintering temperature such as BiNbO 4 , TiO 2 -TeO 2 , and ZnTiO 3 [1,9]. Recently, many studies have been focused on Li-containing compounds which have low sintering temperature and excellent microwave dielectric properties, such as Li 1+x−y Nb 1−3x−3y Ti x+4y O 3 (x = 0.1, y = 0.05-0.175) ceramics [10][11][12], Li 3 [16].…”