Effect of Light on Electroless Nickel Deposition for Solar Cell Applications

Recent advances in electroless nickel‑boron coatings

“…Like polymeric substrates, ceramics are not catalytically active for electroless nickel-boron plating and must be activated by the deposition of catalytic particles on their surface. This is usually carried out by immersion in a colloidal solution that typically includes PdC1 2 , SnCl 2 , or PdCl 2 -strong acid [76][77][78][79][80][81][82][83]. Other, less aggressive solutions can be used for some substrates such as silicon, with additions of NH 4 OH or NH 4 F 2 to the colloidal system [109].…”

Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

“…Electroless Ni-P deposition reaction can occur in an alkaline or acid environment. To study the autocatalytic deposition of Ni accompanied by P incorporation in the film, it is necessary to know the effect of the operating parameters and bath chemistry on the deposition rate and the quality of the deposits, such as the substrate nature [16], pH [17,18], plating temperature [19], stirring [20], light [21], stabilizers [22], complexing agent [23], and additives [24]. In order to perform deposition of electroless Ni-P, the substrate surface needs to be preactivated and presensitized.…”

“…Moniruzzaman and Roy [17] reported that electroless Ni-P coating was produced on carbon steel and polypropylene substrates and pointed out that the coating of good appearances was obtained in the pH ranges between 5.5 and 12.5 on carbon steel and between 8.5 and 12 on the polypropylene. Singh et al [21] investigated the effect of lights on the electroless Ni-P films and found that electroless deposition under the dark was the most suitable for Ni-Cu metallization process. Bulasara et al [20] researched that the stirring had a profound effect on sodium hypophosphite-based electroless Ni baths, which were characterized with lower conversions and higher plating efficiencies without stirring condition.…”

Effect of Processing Parameters on the Protective Quality of Electroless Nickel-Phosphorus on Cast Aluminium Alloy

“…Mallory and Hajdu [29] investigated the effect of bath pH and reported that the P wt% reduces with increasing solution pH from 4.0 to 5.2. Singh et al [30] carried out electroless plating on c-Si solar cell for diverse periods of time ranging from 30 s to longer durations (1-4 min). The main interest was to observe the effect of both immediate and the prolonged immersion on EN depositions.…”