Effect of Ion Beam Bombarding on Stress in TiO2 Thin Films

Special Issue “Advanced Coating Technology by Physical Vapor Deposition and Applications”

“…The major processes for physical vapor depositions include thermal evaporation and sputter deposition. The sputtering technique can densify the deposited thin film and reduce the residual stress in film/substrate system when the deposition temperature below 150 • C [5][6][7]. A large area sputtering target helps to achieve uniform coating for thin-film deposition, so that the thickness can be controlled by easily adjusting the deposition time.…”