Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

Chen, Xu; Xue, Feng; Zhou, Jian; Yao, Yao

doi:10.1016/j.jallcom.2015.01.219

Cited by 124 publications

(43 citation statements)

References 23 publications

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“…The diffused In was confirmed to participate in interfacial reactions, thereby forming Cu-Sn-In IMCs and affecting the wettability of the Sn-Bi solder on the Cu substrate [13]. Tensile strength changed slightly with increasing In addition, while the elongation increased remarkably with the addition of 2.5 wt.% In [13].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 93%

“…When the In content increased to 4% in the Sn-Bi alloy, tensile test results showed that the tensile strength increased slightly with the increase of added In, while the elongation first increased remarkably and then decreased after the addition of 2.5 wt.% In [13]. The diffused In was confirmed to participate in interfacial reactions, thereby forming Cu-Sn-In IMCs and affecting the wettability of the Sn-Bi solder on the Cu substrate [13].…”

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 97%

“…To be specific, two types of Bi-based micropowders, composed of binary Bi-Sn and ternary merits, including high wetting behavior, large creep resistance, and low coefficient of thermal expansion [12][13][14]. However, the relatively low mechanical strength and melting temperature (138°C) of these materials require improvement for their more effective use in flexible interconnection applications [3,15].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…Usually, a plausible explanation for this is that Sn-and Bi-rich grains are heterogeneously nucleated in the formation of certain IMCs. For example, Mokhtari et al demonstrated that the addition of In or Ni can modify the microstructure of Sn-Bi solder; in particular, the addition of 0.5 wt.% In was able to suppress the coarsening of the Bi-rich phase, which means that the Sn-Bi-0.5In solder comprised primary Sn dendrites and eutectic phases [13,15]. Comparatively, Ni appears to have been included in the Sn phase since Ni-containing Sn-Bi solder exhibited eutectic phases and the Ni 3 Sn 4 IMC but did not show any sign of coarsening due to the Bi-rich phase.…”

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

“…The durability and reliability of electronic products, as related to the mechanical properties of the solder joints, have become very important [13,[36][37][38][39][40][41]. This is especially true for portable, wearable devices, which frequently experience mechanical shock loadings caused by external forces [4].…”

Section: Mechanical Propertiesmentioning

confidence: 99%

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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Section: Recent Progress In Soldering Materials 26mentioning

confidence: 93%

Section: Recent Progress In Soldering Materials 26mentioning

confidence: 97%

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

Section: Mechanical Propertiesmentioning

confidence: 99%

See 3 more Smart Citations

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

View full text Add to dashboard Cite

show abstract

Role of the Aging Treatment in the Microstructure Evolution and Mechanical Properties of Cu/Sn-Bi-Ag-In/Cu Joint

Ding

et al. 2022

The Minerals, Metals &Amp; Materials Series

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Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys

Wang

et al. 2019

J Mater Sci

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Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder

Cited by 124 publications

References 23 publications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Role of the Aging Treatment in the Microstructure Evolution and Mechanical Properties of Cu/Sn-Bi-Ag-In/Cu Joint

Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys

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