Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys

Wu, Xulei; Wu, Jiawei; Wang, Xiaojing; Yang, Jie; Xia, Ming; Liu, Bin

doi:10.1007/s10853-019-04148-6

Cited by 24 publications

(6 citation statements)

References 33 publications

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“…The RVE-FE calculations in Figure 10 are also in good agreement with Young’s moduli reported by Lu et al [ 17 ] through nano-indentation and values by El-Daly [ 12 ] through pulsed echo overlap (PEO). Values of Wu et al [ 8 ], Mokhtari et al [ 49 ] and Lai et al [ 50 ] show considerable deviation from the RVE-FE values arising from the specific measurement methods used, where tensile tests in particular underestimate the elastic properties.…”

Section: Resultsmentioning

confidence: 99%

“…Recently, low melting point solders gained interest in the research community, where the Sn-Bi system is a promising candidate for soldering of temperature-sensitive components [ 2 ]. Studies investigated Sn-Bi alloys with respect to alloying elements [ 8 , 9 , 10 ], thermal parameters [ 11 ], magnetic stirring [ 12 ] and directional solidification [ 13 , 14 ]. The effect of In addition in Sn-Bi alloys on melting point and mechanical properties was shown by Wu et al [ 8 ] and microstructural effects due to Cu and Ag additions were investigated by Silva et al [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

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Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

et al. 2020

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This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means of morphology parameters, such as, shape complexity, flatness, elongation and mean intercept length tensor. The investigated alloys are categorized in three groups based on their morphology, which are described as “complex dominant”, “complex- equiaxed” and “mixed”. The mechanical behavior of Sn-Bi alloys in the semi-solid configuration and the correlation with microstructural parameters are discussed. A varying degree of geometric anisotropy of the investigated alloys is found through the mean intercept length tensor. Representative volume element models for finite element simulations (RVE-FEM) are created from tomography data of each alloy to analyze a correlation of geometric and elastic anisotropy. The simulations reveal an elastic isotropic behavior due to the small difference of elastic constants of primary and eutectic phase. A discussion of properties in the semi-solid state and liquid phase healing is provided.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

et al. 2020

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“…Furthermore, incorporating In into Sn-Bi alloys can enhance heat dissipation in electronic systems with high power density. 5 Using temperature variation to heal solder material, particularly in Sn-Bi alloys, is a novel approach recently explored to enhance solder joint reliability under thermomechanical stresses. [6][7][8] Sn-Bi alloys have been shown to exhibit a liquid-assisted healing phenomenon when subjected to compressive forces and elevated temperatures.…”

Section: Introductionmentioning

confidence: 99%

Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys

Spinelli,

Leal,

et al. 2024

J. Electron. Mater.

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With the emergence of new applications for low-melting-point solder alloys, such as self-healing and semisolid additive manufacturing, understanding their long-term microstructural stability has become necessary. Sn-Bi-In alloys provide an attractive option for such applications, with a melting point below 150°C; however, little is known about their long-term stability and microstructural evolution. In this research, we conducted extended stability experiments for Sn-40Bi and Sn-40Bi-10In alloy compositions over three different heat-treatment periods of 12 h, 168 h, and 360 h. The microstructure of the two alloys prominently featured Sn-rich globules, which were observed to be finer in the Sn-40Bi-10In alloy than in the Sn-40Bi composition. The finer globules in Sn-40Bi-10In may be attributed to initial Sn-rich islands, which facilitated improved globule refinement during the semisolid stage. Furthermore, both the size and fraction of the globules were found to increase with increasing heat treatment time in Sn-Bi-In alloy; it was also observed that the Sn-40Bi-10In alloy globules exhibited a gradual rise in overall Bi content with time, whereas the interglobular Sn/Bi/BiIn eutectic regions showed a decrease in Bi content and an increase in Sn content.

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“…In addition, the requirement for low-temperature welding promotes the widespread application of low melting point SnBi and SnIn alloys. Composition difference results in different types of oxides on powder surface, and the phase composition inside the powders, such as SAC (β-Sn matrix + Ag3Sn + Cu6Sn5 intermetallic compound particles) [4], SnBi alloys (Sn-rich + Bi-rich phases) [5], SnIn alloys (In3Sn + InSn4 phase) [6] etc. Taking Sn58Bi as an example, due to the significant difference in standard electrode potential between Bi (0.307 V) and Sn (-0.137 V), the corrosion resistance of Sn58Bi alloys during storage is relatively poor [7].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical noise analysis of corrosion sensitivity of Pb-free solders in 5 wt% citric acid solution

Li,

Cai,

Wang

et al. 2024

Adv Compos Hybrid Mater

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The corrosion behavior of pure Sn, Sn2Ag, Sn42In and Sn58Bi alloys in 5 wt.% citric acid solutions has been investigated using electrochemical noise analysis combined with potentiodynamic polarization, electrochemical impedance spectroscopy tests and etching morphology observation. The results indicated that Sn58Bi has the lowest corrosion rate, followed by Sn2Ag, Sn42In, and Sn. The corrosion evolution of the four alloys mainly consists of two stages as follow：for pure Sn, the first stage is local corrosion (corrosion pits growth) stage and the second stage is uniform corrosion with preferential dissolution of some grains on the sample surface. In contrast, for dual phase alloys, Sn2Ag, Sn42In, and Sn58Bi alloys, all preferentially underwent selective phase corrosion in the first stage, followed by the growth of uniform corrosion and selective phase corrosion in the second stage. The corrosion incubation rates for the four Sn-based alloys: Sn42In > Sn > Sn2Ag > Sn58Bi for both uniform corrosion and local corrosion. While the probability of corrosion growth in sequence was: Sn > Sn58Bi > Sn42In > Sn2Ag (uniform corrosion), Sn58Bi > Sn > Sn42In > Sn2Ag (local corrosion). In this work, the corrosion behaviors were consistent with the observed corrosion morphology, which provided guidance for understanding the interaction between solder alloys surfaces and acid in flux and further selecting organic acid activators compatible with new solder alloys.

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Effect of In addition on microstructure and mechanical properties of Sn–40Bi alloys

Cited by 24 publications

References 33 publications

Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

Analysis of Sn-Bi Solders: X-ray Micro Computed Tomography Imaging and Microstructure Characterization in Relation to Properties and Liquid Phase Healing Potential

Long-Term Microstructural Stability of Sn-40Bi and Sn-40Bi-10In Alloys

Electrochemical noise analysis of corrosion sensitivity of Pb-free solders in 5 wt% citric acid solution

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