Effect of Impact Rate on the Strength of Lead-free Solder Joints

Huang, Yeu‐Shiang; Lin, Kwang Lung; Liu, D.S.

doi:10.1109/eptc.2008.4763622

Cited by 2 publications

(2 citation statements)

References 15 publications

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“…13,14 The high-speed impact test has shown that the failure behavior of a solder joint depends on the material properties of bulk solder and the interfacial structure, such as the interfaces of solder/intermetallic compounds (IMCs) and IMCs/surface finishes. 13,15,16 These results indicated that the (Ni,Cu) 3 Sn 4 IMC may exhibit better bonding strength with the solder and the Au/Ni/Cu substrate than that of (Cu,Ni) 6 Sn 5 IMC. The as-reflowed Sn-1Ag-0.1Cu-0.02Ni-0.05In (SAC101NiIn)/Au/Ni/ Cu solder ball joint shows excellent ductility compared with other Sn-based lead-free solder ball joints.…”

Section: Introductionmentioning

confidence: 88%

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010

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The microstructure and microimpact performance of Sn1Ag0.1Cu0.02Ni0.05In (SAC101NiIn)/AuNi/Cu solder ball joints were investigated after a thermal cycle test (TCT). The joints show complete bulk fracture behavior before TCT. Moreover, TCT facilitated interfacial fracture behavior with lower fracture energy. The intermetallic compounds (IMCs) formed in the solder joints before and after TCT were investigated. TCT induces a variety of structural variations in the solder joints, including slipping bands, whisker formation, the squeezing of the IMC layer, the formation of cavities, the rotation and pop-up of grain, and the deformation and rotation of the entire joint. The variations in fracture behavior induced by TCT are correlated with the structural variations in the solder joints.

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Section: Introductionmentioning

confidence: 88%

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

2010

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“…The cleaver can move freely to form the second joint in any direction without damaging the ball neck of the first joint, increasing the bonding speed. Thermal ultrasonic ball bonding is more reliable than wedge bonding at room temperature [3].…”

Section: Introductionmentioning

confidence: 98%

Optimization of 25 µm gold wire lead bonding process parameters based on orthogonal test

Feng

Wang²,

Guan

2023

J. Phys.: Conf. Ser.

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The gold wire lead bonding process is a key technology to realize the electrical connection between the chip and the external control circuit to be completed. This paper introduces the basic concept of lead bonding technology and analyzes the process parameters affecting the quality of lead bonding, mainly including ultrasonic power, ultrasonic time, and bonding pressure. The orthogonal test method is used to investigate the process parameters affecting the bonding quality of 25 μm gold wire. The optimal combination of process parameters A3B2C2 is determined, i.e., the ultrasonic power value is 90 mW, the ultrasonic time is 20 ms, and the bonding pressure is 40 gf, which improves the reliability of the wire bonding process.

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Effect of Impact Rate on the Strength of Lead-free Solder Joints

Cited by 2 publications

References 15 publications

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test

Optimization of 25 µm gold wire lead bonding process parameters based on orthogonal test

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