Abstract:The gold wire lead bonding process is a key technology to realize the electrical connection between the chip and the external control circuit to be completed. This paper introduces the basic concept of lead bonding technology and analyzes the process parameters affecting the quality of lead bonding, mainly including ultrasonic power, ultrasonic time, and bonding pressure. The orthogonal test method is used to investigate the process parameters affecting the bonding quality of 25 μm gold wire. The optimal combi… Show more
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