2010
DOI: 10.1016/j.jallcom.2010.04.219
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Effect of hydrogen content on superplastic forming/diffusion bonding of TC21 alloys

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Cited by 20 publications
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“…At 860 • C and 30 MPa for 10 min, the voids disappear completely [10]. The interfacial void evolution has been investigated in the bonding process of steels [11], aluminum alloys [12], magnesium alloys [13] and titanium alloys [14]. In addition, multiform mathematic models have been established to predict the void shrinking process based on the mechanisms of diffusion and plastic flow [15][16][17].…”
Section: Introductionmentioning
confidence: 99%
“…At 860 • C and 30 MPa for 10 min, the voids disappear completely [10]. The interfacial void evolution has been investigated in the bonding process of steels [11], aluminum alloys [12], magnesium alloys [13] and titanium alloys [14]. In addition, multiform mathematic models have been established to predict the void shrinking process based on the mechanisms of diffusion and plastic flow [15][16][17].…”
Section: Introductionmentioning
confidence: 99%
“…The maximum bonding ratio, i.e. 96.28 %, can be obtained at 1,050°C, and 0.9 yield strength for 24 h. Wang et al [8] discussed the effect of hydrogen content and temperature on the bonding ratio in the DB of TC21 alloy. The bonding ratio increases with an increase in hydrogen content and reaches a maximum value as the hydrogen content is 0.5 wt%.…”
Section: Introductionmentioning
confidence: 99%