Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications

Kumaresan, Vigneshwarram; Sreekantan, Srimala; Devarajan, Mutharasu; Mohamed, Khairudin

doi:10.1007/s10854-020-04864-9

Cited by 6 publications

(1 citation statement)

References 51 publications

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“…Addition-cure liquid silicone rubber (ALSR) is a packaging material that has been widely application in electronics, electrical power, and electrical elds [1][2][3][4][5] because of its excellent high-and low-temperature resistance, good elastic properties, and lack of by-product residues or volatiles. However, practical application of pure ALSR is severely hindered by its poor mechanical properties [6,7] and poor erosion resistance [8][9][10][11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Sheng-pei

Wang

et al. 2021

Preprint

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It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified eucommia gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 102 Hz, 103 Hz and 104 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.

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Section: Introductionmentioning

confidence: 99%

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Sheng-pei

Wang

et al. 2021

Preprint

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Excellent thermal conductive epoxy composites via adding UHMWPE fiber obtained by hot drawing method

Shi,

Jiang,

Wang

et al. 2024

Polymer Composites

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The continuous updating and iteration of electronic devices brings about a significant accumulation of heat. It is urgent to enhance the thermal properties of polymer‐based composites to alleviate the heat dissipation problem in the microelectronics industry. In this paper, the hot drawing process was introduced to increase the crystallinity of ultra‐high molecular weight polyethylene (UHMWPE) fiber and improve its thermal conductivity. The ultra‐high molecular weight polyethylene fiber/epoxy resin (UHMWPE fiber/Epoxy) composites with high thermal conductivity were prepared by compositing UHMWPE fiber with epoxy resin under vacuum conditions. Due to the good crystallinity of the UHMWPE fiber (86%), an efficient thermal conduction path is provided for phonons in the axial direction along the fibers. The results show that the thermal conductivity of the composites reaches a maximum of 3.51 W/mK (in‐plane), which is 17.47 times higher than that of the epoxy resin (0.19 W/mK). The thermography pictures indicate that the composites have better heat transfer capacity with an increase in the draw ratio (λ). In addition, the composites also have the characteristics of low density and low electrical conductivity. These researches will provide a new idea for the preparation of all‐polymer composites with high thermal properties.Highlights A hot drawing process was introduced to increase the crystallinity of UHMWPE fiber for improving thermal conductivity. High crystallinity facilitates the reduction of phonon scattering and the transmission of thermal energy by phonons. The obtained polymer composites exhibit an ultra‐high in‐plane thermal conductivity.

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Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber

Wang

et al. 2021

J Mater Sci: Mater Electron

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It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an e cient approach to address this issue by lling silicone-modi ed eucommia gum nano ller (SEUG) into ALSR.By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was signi cantly lower than that of neat ALSR both at 10 2 Hz, 10 3 Hz and 10 4 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our ndings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.

show abstract

Effect of hybrid filler ratio and filler particle size on thermal conductivity and oil bleed of polydimethylsiloxane/Al2O3/ZnO liquid thermal filler for microelectronics packaging applications

Cited by 6 publications

References 51 publications

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Excellent thermal conductive epoxy composites via adding UHMWPE fiber obtained by hot drawing method

Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber

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