Excellent thermal conductive epoxy composites via adding UHMWPE fiber obtained by hot drawing method
Shanshan Shi,
Tao Jiang,
Ying Wang
et al.
Abstract:The continuous updating and iteration of electronic devices brings about a significant accumulation of heat. It is urgent to enhance the thermal properties of polymer‐based composites to alleviate the heat dissipation problem in the microelectronics industry. In this paper, the hot drawing process was introduced to increase the crystallinity of ultra‐high molecular weight polyethylene (UHMWPE) fiber and improve its thermal conductivity. The ultra‐high molecular weight polyethylene fiber/epoxy resin (UHMWPE fib… Show more
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