Effect of heat treatment on stress in electron-gun evaporated SiO2 films

Koos, V.; Neumann, Hava

doi:10.1002/pssa.2210280154

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1976

1985

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“…Subsequently the oxide-coated wafers were annealed and the stress-temperature curves measured. The results of these measurements are given elsewhere [2]. Repeated annealing gave only linear thermal stresses in the oxide films.…”

Section: Sample Preparationmentioning

confidence: 99%

Structure and intrinsic stress of nickel silicide films

Koos

Beck

Neumann

1976

Phys. Stat. Sol. (a)

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Stress measurements on nickel silicide films formed by the reaction of evaporated nickel films with both amorphous and monocrystalline silicon substrates are presented. By comparison with structural investigations it is shown that the formation of the silicides in the films is connected with stress changes. These stress changes are given for several silicides.Es werden Spannungsmessnngen an Nickelsilizidschichten vorgestellt, die durch Reaktion von aufgedampften Nickelschichten sowohl mit amorphen 81s auch mit einkristallinen Siliziumsubstraten entstanden sind. Der Vergleich mit Strukturuntersuchungen zeigt, daB die Bildung der Silizide in den Schichten mit Spannungsiinderungen verbunden ist. D i m werden fur einige Silizide angegeben.

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Section: Sample Preparationmentioning

confidence: 99%