2009
DOI: 10.1016/j.jallcom.2008.07.126
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Effect of growth and annealing temperatures on crystallization of tantalum pentoxide thin film prepared by RF magnetron sputtering method

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Cited by 46 publications
(29 citation statements)
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References 20 publications
(27 reference statements)
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“…In general, to improve structural and optical properties of the deposited oxide on a substrate, post-deposition annealing is performed at various temperatures and ambients [52][53][54]. The effects of annealing temperature and ambient have been shown by pulsed laser deposited [55] and RF magnetron sputtered tantalum oxide (Ta 2 O 5 ) [56], successive ionic layer adsorption and reaction technique deposited [57] as well as pulsed laser deposited ZnO film [31], and pulsed laser deposited titanium oxide (TiO 2 ) thin film [58], indicating that physical properties of the deposited films were improved.…”
Section: Introductionmentioning
confidence: 99%
“…In general, to improve structural and optical properties of the deposited oxide on a substrate, post-deposition annealing is performed at various temperatures and ambients [52][53][54]. The effects of annealing temperature and ambient have been shown by pulsed laser deposited [55] and RF magnetron sputtered tantalum oxide (Ta 2 O 5 ) [56], successive ionic layer adsorption and reaction technique deposited [57] as well as pulsed laser deposited ZnO film [31], and pulsed laser deposited titanium oxide (TiO 2 ) thin film [58], indicating that physical properties of the deposited films were improved.…”
Section: Introductionmentioning
confidence: 99%
“…Binding energy and chemical atomic ratio O:Ta calculated from XPS data at different substrate temperatures by Wu et al[20].…”
mentioning
confidence: 99%
“…The surface roughness is comparable to earlier work. However, the surface chemical atomic ratio is lower than the ideal stoichiometric value of 1:2.5 [31]. A high temperature and pure oxygen atmosphere is incompatible with both the fabrication technique and CMOS technology.…”
Section: B Post-processing Of the Cmos Chipmentioning
confidence: 99%
“…The working pressure was 100 ”bar. It has been shown that an optimised process can deposit films with an ideal surface stoichiometric ratio and good surface roughness [31]- [33]. As shown in Fig.…”
Section: B Post-processing Of the Cmos Chipmentioning
confidence: 99%