Effect of grain size on the electrical conductivity of copper–iron alloys

Abbas, Sardar Farhat; Seo, Seok-Jun; Park, Kyoung-Tae; Kim, Bum-Sung; Kim, Taek‐Soo

doi:10.1016/j.jallcom.2017.05.244

Cited by 38 publications

(14 citation statements)

References 25 publications

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“…Since the electrical conductivity of copper is very sensitive to impurity elements [31,32], the major part of the 5 -6% IACS reduction could be attributed to the 100 -200 ppm of impurities that are present in the L-PBF fabricated copper part (refer to Table 1). Moreover, other factors such as porosity of ≈ 0.7% (as per the Archimedes density measurements) [33], measurement of electrical conductivity perpendicular to the building direction (BD) [34], dislocations, and fine-grain microstructure [35] of the L-PBF processed part could have also contributed to the lowering of the electrical conductivity.…”

Section: The As-built Properties Of the Near Full Density Bulk Solid Copper Partmentioning

confidence: 99%

Laser-based powder bed fusion additive manufacturing of pure copper

Jadhav

Goossens

Kinds

et al. 2021

Additive Manufacturing

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In this article, the laser-based powder bed fusion (L-PBF) processing behavior of pure copper powder is evaluated by employing a conventional infrared fiber laser with a wavelength of 1080 nm, a small focal spot diameter of 37.5 µm, and power levels up to 500 W. It is shown that bulk solid copper parts with near full density (ρ Archimedes = 99.3 ± 0.2%, ρ Optical = 99.8 ± 0.1%) can be produced using a laser power of 500 W for the chosen combination of powder particle size, L-PBF settings, and pure copper baseplate. Moreover, at 500 W, parts with a relative density exceeding 99% are manufactured within a volumetric energy density window of 230 -310 J/mm 3 , while laser power levels below 500 W did not produce parts with a relative density above 99%. An analytical model is used to elucidate the L-PBF processing behavior, wherein both conduction and keyhole regimes corresponding to the employed L-PBF settings are identified. The analytical model-based results predict that the bulk solid copper parts with near full density are produced in a keyhole regime prior to the onset of keyholeinduced porosity, which is in accordance with the porosity types observed in the parts. The L-PBF fabricated copper parts exhibit an electrical conductivity of 94 ± 1% compared to the international annealed copper standard (IACS) and demonstrate a tensile strength of 211 ± 4 MPa, a yield strength of 122 ± 1 MPa, and an elongation at break of 43 ± 3% in the as-built condition.

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Section: The As-built Properties Of the Near Full Density Bulk Solid Copper Partmentioning

confidence: 99%

Laser-based powder bed fusion additive manufacturing of pure copper

Jadhav

Goossens

Kinds

et al. 2021

Additive Manufacturing

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“…Fe: MA of Cu-Fe powder or SPD treatment of two phase alloy leads to the formation of supersaturated fcc solid solutions with up to 60-70 at.% Fe in Cu [68][69][70][71], whereas equilibrium state has shown immiscibility between Cu and Fe [6]. Fu et al have found that by powder metallurgy (combustion synthesis) nanostructured matrix with dendrite composite Cu-Fe alloy can be successfully obtained [72].…”

Section: Stacking Fault Energies In Copper In 3d Transition Metal Alloysmentioning

confidence: 99%

“…Copper and Cu based alloys are widely investigated due to high strength and high electrical and thermal conductivity [1][2][3][4][5][6][7][8][9]. High strength of copper alloys might be caused by nanoscale precipitates [10], deformation twining [11,12], and/or solid solutions strengthening [13].…”

Section: Introductionmentioning

confidence: 99%

Generalised stacking fault energies of copper alloys - density functional theory calculations

Muzyk

Kurzydłowski

2019

J min metall B Metall

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Generalised stacking fault energies of copper alloys have been calculated using density functional theory. Stacking fault energy of copper alloys is correlated with the d-electrons number of transition metal alloying element. The tendency to twiningis also modified by the presence of alloying element in the deformation plane. The results suggest that Cu-transition metal alloys with such elements as Cr, Mo, W, Mn, Re are expected to exhibit great work hardening rate due to the tendency to emission of the partial dislocations.

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“…Many efforts have been made by introducing a secondary phase into Cu matrix for achieving the excellent electrical and thermal conductivity as well as high strength and plasticity. Thereinto, some transitional metal micro-particles (Nb [ 4 , 5 ], Ag [ 6 , 7 ], Fe [ 8 , 9 , 10 ] and Cr [ 11 ]) are attempted and added into Cu to adjust the microcomposites, and further adjust the structural characteristic of materials by means of various alloying and preparation methods. In these Cu-based microcomposites, the specific advantage of Cu–Fe system is the relatively low cost of Fe compared with both of Cu–Nb and Cu–Ag systems [ 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Microstructure, Mechanical and Electrical Properties of Hybrid Copper Matrix Composites with Fe Microspheres and rGO Nanosheets

Zhang

Zhan

et al. 2022

Molecules

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Copper matrix composites have a wide application as magnetic conductive materials, electromagnetic materials, electrical discharge machining materials, etc. Such materials are expected to have a good combination of excellent electrical conductivity and good mechanical strength. In this work, micro/nano hybrid reinforcements with Fe microspheres and reduced graphene oxide (rGO) nanosheets were developed for copper matrix composites. The rGO/Fe/Cu powders were firstly wet-mixed and then densified by the vacuum hot-pressing sintering to obtain the bulk compacts. Microstructure, electrical conductivity and mechanical properties of such compacts were investigated. Microstructural result of as-sintered compacts shows that the Fe microspheres could distribute in the matrix uniformly, and rGO nanosheets exhibit both agglomerated and dispersed states. The grain size of Cu matrix decreased with the increase of the rGO content. Hardness, compression and tensile 0.2% yield strength of the as-sintered compacts were improved evidently by the addition of the hybrid Fe/rGO, comparing with pure Cu and single Fe-added composites. However, a lower electrical conductivity appeared in the more rGO-added composites, but still reached more than 33.0% international annealing copper standard (IACS). These performance change could be sought in the spatially geometrical distribution and characteristics of such micro/nano Fe/rGO hybrid addition, and the relevant mechanisms were discussed.

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Effect of grain size on the electrical conductivity of copper–iron alloys

Cited by 38 publications

References 25 publications

Laser-based powder bed fusion additive manufacturing of pure copper

Laser-based powder bed fusion additive manufacturing of pure copper

Generalised stacking fault energies of copper alloys - density functional theory calculations

Microstructure, Mechanical and Electrical Properties of Hybrid Copper Matrix Composites with Fe Microspheres and rGO Nanosheets

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