2022
DOI: 10.1002/pssa.202200183
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Effect of Gas Flow Rate in PECVD of Amorphous Silicon Thin Films for Interface Passivation of Silicon Heterojunction Solar Cells

Abstract: Precursor gas flow rate variation (30–80 sccm) in the plasma‐enhanced chemical vapor deposition (PECVD) process of intrinsic a‐Si:H layer deposition using SiH4/H2 (equal ratio) plasma is explored and its effect on the i‐a‐Si:H/c‐Si interface passivation is investigated. A window of intermediate gas flow rates is determined for good quality surface passivation of n‐type c‐Si. Maximum effective minority carrier lifetime (τeff) above 1 ms, implied open‐circuit voltage (iVoc) ≈ 710 mV, and low interface defect den… Show more

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Cited by 12 publications
(5 citation statements)
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“…This could lead to a wider use of solar energy as a clean and renewable energy source [29]. Here we present, a-Si: H nanostructures on a solid nanosphere substrate by incorporating reactive hydrogen ions [30]. Due to the low aspect ratio of a-Si: H nanowires, the light trapping effect was almost invisible in previous studies [31].…”
Section: Introductionmentioning
confidence: 91%
“…This could lead to a wider use of solar energy as a clean and renewable energy source [29]. Here we present, a-Si: H nanostructures on a solid nanosphere substrate by incorporating reactive hydrogen ions [30]. Due to the low aspect ratio of a-Si: H nanowires, the light trapping effect was almost invisible in previous studies [31].…”
Section: Introductionmentioning
confidence: 91%
“…Subsequently, the obtained pyramids were rounded through a chemical polishing step using HNO 3 , CH 3 COOH, and HF in the ratio of 10:2:1 for 20 s. Further, the textured wafers were cleaned using the standard RCA procedures followed by an HF dip before loading them into the PECVD chamber. Both sides ∼8 nm i-a-Si:H layers were deposited in one reaction chamber with SiH 4 :H 2 gas flow ratio 1:1 [16]. Further, the ∼20 nm n-nc-Si:H layer was deposited in the same chamber using 27.12 MHz frequency at 200 °C at 1 Torr pressure and 122 mW cm −2 power density (P d ) for 15 min.…”
Section: Fabrication and Characterization Of Front Emitter Shj Solar ...mentioning
confidence: 99%
“…Finally, a largearea SHJ solar cell was created with a V OC of 0.732 V and an efficiency of 22.25%. Pandey et al 35 applied RF-PECVD at 13.56 MHz to deposit a-Si: H films on both sides of n-type Si wafers. The substrate temperature was set at 230 °C, the interelectrode spacing was fixed at 20 mm, the deposition pressure was 1 Torr, the power density was 44 mW cm −2 , the V(SiH 4 ):V(H 2 ) ratio was set at 1:1, and the total gas flux (FR) varied from 30 sccm to 80 sccm.…”
Section: Surface Passivation Materialsmentioning
confidence: 99%