Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

Chen, L.D.; Huang, Mingliang; Zhou, Shaoming

doi:10.1016/j.jallcom.2010.05.158

Cited by 81 publications

(22 citation statements)

References 17 publications

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“…Similarly, it was reported that the main difference between the aged specimens (without current) and electromigration specimens (with current) was the driving force for atom movement. The driving force in the aged specimens was the chemical potential, whilst that in the electromigration specimens included both chemical potential and electron wind force [8]. It can also be seen that the growth rates of IMC are different at the anode and cathode of the samples.…”

Section: Results and Dicussionmentioning

confidence: 99%

“…Among all the lead-free solders that have been developed, SneAgeCu alloys have been regarded as one of the most promising candidates to replace SnePb solder due to their superior mechanical properties of strength, creep and fatigue resistance [21,22]. Other candidates to substitute SnePb is the eutectic and near-eutectic SneZn which have low melting temperature (198 C), high strength, good creep resistance and high thermal fatigue resistance [8,23]. However, the SneZn system solders show poor wetting during soldering to electrodes [24].…”

Section: Introductionmentioning

confidence: 99%

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Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Othman¹,

Binh²,

Ismail³

et al. 2012

Intermetallics

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Section: Results and Dicussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Othman¹,

Binh²,

Ismail³

et al. 2012

Intermetallics

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“…Зараз більшість безоли-вних прилютків є стопами на основі цини (вміст Sn більше ніж 95 %), а отже, властивості цини є домінувальними в поведінці при-пою. Тому реакції на межі між циною і різними металевими під-ложжями (Ni, Cu, Ag), особливо при великих густинах струму, ін-тенсивно досліджуються [15][16][17].…”

Section: вступunclassified

“…В. КОРНІЄНКО, Д. О. ЗРАЄВ і показують, що на обох електродах ріст фаз відбувається швидше ніж для випадку, коли електричний струм відсутній. Відмітимо, що подібну кінетику росту ІМС при ЕМ спостерігали також і у на-ступних дослідженнях: [7,17,25]. Зауважимо, що в нашій роботі відпал для досліджування росту ІМС при відсутності струму здійс-нювався при 178С, що на 3С вище, ніж зі струмом, щоб компенсу-вати вплив додаткового нагріву за рахунок Джоулевого тепла.…”

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Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Zraev¹

2016

Metallofiz. Noveishie Tekhnol.

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Проведено експериментальне дослідження реакційної дифузії в системі Cu-Sn під дією постійного електричного струму густиною у 7,310 7 А/м 2 . Особливістю експерименту було те, що конструкція досліджуваного зраз-ка виключала можливість перенесення атомів Купруму від катоди до ано-ди через спільний прошарок цини. За таких умов ріст фази Cu 3 Sn  Cu 6 Sn 5 на аноді відбувається швидше, ніж на катоді. Кінетика росту відповідає лінійному часовому закону x  t. З використанням моделю процесу реа-кційної дифузії при електроміґрації було проведено аналізу одержаних експериментальних результатів.Ключові слова: електроперенесення, реакційна дифузія, інтерметалева сполука, Cu/Sn.The experimental study of the reaction diffusion under direct electric current in Cu-Sn system at temperature of 275C is performed. The current density is of 7.310 7 А/m 2 . In these experiments, anode and cathode have no joint contact through the solder layer. With this design of sample, the diffusion of copper atoms from the cathode to the anode is impossible. In these experimental conditions, the growth of the Cu 3 Sn  Cu 6 Sn 5 phase on the anode is faster than on the cathode. The growth kinetics of phase on the electrodes corresponds to a linear time law x  t. The voids' growth on the cathode is not observed. When the anode is joined to cathode by the solder layer, the Corresponding author: Semen Viktorovych Kornienko

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“…During EM, atoms move along the direction of electron flow towards the anode side of the solder joint. As a result, voids, cracks, or damages can be generated at the cathode side [5][6][7]. High current density in small solder joints increases the occurrence of EM failures [8].…”

Section: Introductionmentioning

confidence: 99%

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

et al. 2015

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The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 9 10 4 A/cm 2 , at 80 ± 3°C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.

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Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

Cited by 81 publications

References 17 publications

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Effects of current density on the formation and microstructure of Sn–9Zn, Sn–8Zn–3Bi and Sn–3Ag–0.5Cu solder joints

Influence of Electromigration on Kinetics of Reaction Diffusion in the Cu—Sn System

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

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