Effect of electroless Ni-P thickness on EFTECH 64-Ni, EFTECH 64-Cu and C194-Ni bump

Ong, Cheng-Guan; Lau, Kok-Tee; Zaimi, Muhammad; Afiq, Muhammad; Queck, Kian-Pin

doi:10.1109/impact.2016.7799982

Cited by 3 publications

(1 citation statement)

References 6 publications

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“…Similarly, the addition of 3.3 wt.% Ti to Cu produced a copper-titanium alloy (C1990 HP) with good strength, electrical conductivity, workability, fatigue, and corrosion resistance [12]. These substrates have the potential to be suitable as lead-frame materials to change the conductor Cu, since many researchers have conducted experiments related to their reliability [11,[13][14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates

Laksono

Tsai

Chung

et al. 2022

Metals

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Cu-based alloys are one of the most promising substrates to enhance the performance of lead-frame materials. In the present study, the interfacial reactions in the Sn-0.7 wt.% Cu (SC) lead-free solder reacting with Cu-3.3 wt.% Fe (C194), Cu-2.0 wt.% Be (Alloy 25), and Cu-3.3 wt.% Ti (C1990 HP) were investigated. The material underwent a liquid–solid interface reaction, and the reaction time was 0.5 to a few hours at the reaction temperatures of 240 °C, 255 °C, and 270 °C. The morphology, composition, growth rate, and growth mechanism of the intermetallic compounds (IMCs) formed at the interface were investigated in this study. The results showed that the reaction couples of SC/C194, SC/Alloy 25, and SC/C1990 HP formed IMCs, which were the [(Cu, Fe)6Sn5 and (Cu, Fe)3Sn], [(Cu, Be)3Sn and (Cu, Be)6Sn5], and [Cu6Sn5] phases, respectively. Finally, the IMC growth mechanism for the SC/C194, SC/Alloy 25, and SC/C1990 HP couples displayed reaction control, grain boundary diffusion control, and diffusion control, respectively.

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