Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder

Wang, X. J.; Zhu, Qing–Ling; Liu, B.; Liu, N.; Wang, F. J.

doi:10.1007/s10854-014-1875-5

Cited by 15 publications

(9 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These particles in the solder can hinder the lattice dislocation by blocking grain boundaries and form intermetallic compounds (IMCs) that have better characteristics, to make the grain finer and improve the resistant to thermal, mechanical and electrical stresses [6][7][8]. Metals, such as Ag, Au, Al, Ni, Cu, Cd, Zn, Mo and some rare-earth materials [9,10], and non-metallic materials, such as SiC, TiO 2 , Al 3 O 2 , carbon tube, graphen and even diamond [11][12][13][14][15], are studied as the doped particles to improve the mechanical properties of lead-free solder joints. According to these studies, there are two methods that are commonly used to add the reinforced particles into the solder.…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

show abstract

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…To break the temperature limitation of Bi-based LM and to broaden the application scope of Bi-based LM, optimization of the alloy surface or interior is required, such as modification of the surface of the alloy particles with silane compounds in the wet process, incorporation of trace amounts of reactive elements (e.g., Al and Mg) into the alloy, and adjustment of the composition of the co-alloys are used to improve the oxidation resistance and reactivity and stability of the alloy. 80,82 In addition, when Bi-based alloys are used as nuclear coolants, LM embrittlement (LME) is induced in steels at high temperatures. For example, martensitic T91 steel is prone to LME via Pb-Bi.…”

Section: Chemical Propertiesmentioning

confidence: 99%

Bismuth-based liquid metals: advances, applications, and prospects

Zhang,

Liu,

Deng

2024

Mater. Horiz.

View full text Add to dashboard Cite

show abstract

“…Mokhtari et al [24] also obtained similar results through experimental research. Wang et al [25]studied the relationship between Al element and the wettability of Sn-Bi solder. He found that the wettability and spreading area of Sn-Bi solder decreased gradually with the increase of Al content.…”

Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%