Effect of Different Filler Wires on Mechanical Property and Conductivity of Aluminum-Copper Joints

Abstract

The 1060 aluminum and T2 copper were joined by the pulsed double electrode gas metal arc welding (DE-GMAW) brazing method by using four types of filler wires, namely pure aluminum (Al) ER1100, aluminum-magnesium (Al–Mg) ER5356, aluminum-silicon (Al–Si) ER4043, and Al–Si ER4047, respectively. The effects of different types of filler wires on intermetallic compounds, microhardness tensile strength, and conductivity of joints were investigated. The results showed that a lot of brittle intermetallic compounds laying in the copper side brazing interface zone were generated using pure Al, Al–Mg, and Al–Si filler wires, which caused the change of microhardness, tensile strength, and the conductivity of joints. Meanwhile, with the increase in Si elements contents for Al–Sifiller wires, the thickness of the intermetallic compound layers decreased obviously, which was only up to 3 µm and the conductivity of the joints decreased. In addition, the microhardness, tensile strength, and the conductivity of the joints, when using Al–Sifiller wires, was higher than that using pure Al and Al–Mg filler wires. Hence, in comparison to the pure filler wires and Al–Mg filler wires, the Al–Si filler wires were more suitable for Al–Cu joints by DE-GMAW as Si element content was lower.

Study on the Microstructure and Mechanical Properties of Butt GMAW Al/Fe Dissimilar Joints using Pure Copper Filler Metal

“…It can be confirmed that, in the Fe-Cu binary system, there are no Fe-Cu intermetallic compounds 6,7) . Based on this, the idea of using pure copper filler metal for dissimilar welding of aluminum and steel was obtained in the study.…”

Influence of Filler Alloy on Microstructure and Properties of Induction Brazed Al/Cu Joints

“…Li et al 29 considered that it was difficult for Si to form IMCs with Cu or Al due to its non-metallic properties, which can control the growth of IMCs. The joint brazed with Al-12Si filler metal had the highest tensile strength and the joint brazed with Al-5Si filler metal had the highest electrical conductivity 30 . In transient liquid phase bonding with Al-11Si-4Cu-2Mg and Al-4.5Si-1Cu-1Mg interlayer 31 , Mg had no influence on the formation of IMCs and Si decrease the thickness of IMCs by suppressing the growth of CuAl 2 , which lead to a high shear strength and conductivity joint.…”