2011
DOI: 10.1016/j.jallcom.2010.12.163
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Effect of CuO on the sintering temperature and piezoelectric properties of MnO2-doped 0.75Pb(Zr0.47Ti0.53)O3–0.25Pb(Zn1/3Nb2/3)O3 ceramics

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Cited by 34 publications
(11 citation statements)
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References 23 publications
(18 reference statements)
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“…Moreover, with increasing frequency, the permittivity of the ferroelectric phase decreases and the peak temperature of 269.3°C at 1 kHz slightly shifts toward a higher value of 270.2°C at 100 kHz, indicating that the PZ 0.48 T 0.52 -PZNN ceramic is a relaxor. 24,25 For use in piezoelectric multilayer devices, piezoelectric ceramics are required to be sintered at temperatures below 960°C, as the melting temperature of the Ag electrode used in multilayer devices is 961°C. Figure 8(a) shows the relative density, d 33 , e T 33 /e o , k p , and Q m values of the CuO-added PZ 0.48 T 0.52 -PZNN ceramic sintered at 900°C for 2 h. The PZ 0.48 T 0.52 -PZNN ceramic without the CuO additive could not be sintered at 900°C.…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, with increasing frequency, the permittivity of the ferroelectric phase decreases and the peak temperature of 269.3°C at 1 kHz slightly shifts toward a higher value of 270.2°C at 100 kHz, indicating that the PZ 0.48 T 0.52 -PZNN ceramic is a relaxor. 24,25 For use in piezoelectric multilayer devices, piezoelectric ceramics are required to be sintered at temperatures below 960°C, as the melting temperature of the Ag electrode used in multilayer devices is 961°C. Figure 8(a) shows the relative density, d 33 , e T 33 /e o , k p , and Q m values of the CuO-added PZ 0.48 T 0.52 -PZNN ceramic sintered at 900°C for 2 h. The PZ 0.48 T 0.52 -PZNN ceramic without the CuO additive could not be sintered at 900°C.…”
Section: Resultsmentioning
confidence: 99%
“…Many studies were held for lower temperature sintering process [4][5][6]. This multi-layered structure was possible by using low sintering temperature by material composition such as addition of CuO [7][8][9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%
“…The challenges for fabrication of functional PZT/LTCC microdevices are formulating piezoelectric compositions which can be integrated/co‐fired with LTCC packaging materials and developing compatible processing methods to build the co‐fired multilayer structures with minimal defects . Previously, low fire PZT‐based piezoelectric ceramics have been studied with the aim of fabricating multilayer devices co‐fired with either LTCC materials and/or low melting temperature electrodes . Attempts have also been made to characterize dielectric and piezoelectric properties of PZT thick films fired on LTCC substrates .…”
Section: Introductionmentioning
confidence: 99%
“…[9][10][11] Previously, low fire PZT-based piezoelectric ceramics have been studied with the aim of fabricating multilayer devices co-fired with either LTCC materials and/ or low melting temperature electrodes. [12][13][14] Attempts have also been made to characterize dielectric and piezoelectric properties of PZT thick films fired on LTCC substrates. [15][16][17] However, producing PZT/LTCC multilayer ceramics for microdevice fabrication with high piezoelectric properties, high yield, and suitable reliability is a challenging task where technological obstacles still exist.…”
Section: Introductionmentioning
confidence: 99%