Effect of Cu, Ag on the microstructure and IMC evolution of Sn5Sb–CuAgNi/Cu solder joints

et al. 2021

SSMT

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Purpose The purpose of this paper is to investigate the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates in different soldering processes and the effects of alloying elements on the wettability. Design/methodology/approach Sn-5Sb-CuNiAg solder balls (750 µm in diameter) were spread and wetted on 40 × 40 × 1 mm copper plates, in different fluxes, soldering temperatures and time. The contact angles were obtained by a home-made measuring instrument. The samples were polished and deep etched before analyzed by scanning electron microscopy. Energy dispersive X-ray spectroscopy was used to identify the composition of the joints. Findings The effects of different soldering processes and alloying elements on the wetting behaviors of Sn-5Sb-CuNiAg solders on copper substrates were calculated and expounded. The rosin-based flux could effectively remove oxidation layers and improve the wettability of Sn-5Sb-CuNiAg solders. Then with the increase of soldering temperature and time, the contact angles decreased gradually. The soldering processes suited for Sn-5Sb-CuNiAg solders were RMA218, 280°C and 30 s. Considered the effects of alloying elements, the wettability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag was relatively favorable on copper substrates. Besides, Ni could accumulate at the solder/Cu interface and form a jagged (Cu,Ni)6Sn5 IMC. Originality/value This work was carried out with our handmade experiment equipment and the production of the quinary lead-free solder alloy used in wetting tests belongs to us. The investigated Sn-5Sb-CuNiAg alloys exhibited higher melting point and preferable wettability, that was one of the candidates for high-temperature lead-free solders to replace high-Pb solders, and applied extremely to high temperature and frequency working environments of the third-generation semiconductors components, with a greater potential research and development value.

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Section: Effects Of Alloying Elements On the Wettabilitymentioning

confidence: 94%

“…The alloys were smelted repeatedly three times, and then cooled and sealed to prevent reoxidation. In a previous investigation (Han et al, 2019), the melting points (liquidus temperatures) of the Sn-5Sb-based solder alloys were determined by differential scanning calorimetry and are given in Table 1.…”

Section: Smelting Of Solder Alloysmentioning

confidence: 99%

Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate

Wang

et al. 2021

SSMT

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“…As shown in the figure, the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu had a better creep resistance than Cu/Sn-5Sb/Cu. A previous study proved that the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu joint had better plasticity than Cu/Sn5Sb/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. Figure 1(c) is the shear distance-force of the joints, the plastic distance of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu was larger than that of Sn5Sb/Cu, and the force of Cu/Sn5Sb/Cu increased more sharply than Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c.…”

Section: Resultsmentioning

confidence: 93%

“…A previous study proved that the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu joint had better plasticity than Cu/Sn5Sb/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. Figure 1(c) is the shear distance-force of the joints, the plastic distance of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu was larger than that of Sn5Sb/Cu, and the force of Cu/Sn5Sb/Cu increased more sharply than Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. In conclusion, the mechanical properties of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu, including the hardness, creep performance and plasticity, were much better than those of Cu/Sn-5Sb/Cu.…”

Section: Resultsmentioning

confidence: 93%

“…To narrow the research gap, a new low-cost lead-free solder alloy, Sn5Sb-0.5Cu-0.1Ni-0.5Ag, was obtained by adding Cu, Ni and Ag elements to the Sn5Sb matrix, which from previous studies, could be used in secondary reflow soldering processes such as double-sided circuit board SMT assembly (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019cLi et al, 2012;Hegde et al, 2009;Hammad, 2013). The alloy has the potential for application due to its better solderability than Sn5Sb.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Zhang

et al. 2022

SSMT

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Purpose This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism. Design/methodology/approach The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints. Findings The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis for the development of Sn–Sb alloy with good mechanical properties. Originality/value This paper reveals that the hardness and the modulus of the bulk solder Cu/Sn–5Sb/Cu solder joints were improved with the addition of Cu, Ni and Ag trace elements. Meanwhile, the creep resistance and plasticity were also improved. This study has a great value for exploring high-performance Sn–Sb based solder alloy and has proved an example.

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Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging

J Mater Sci: Mater Electron

et al. 2019