Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging

Han, Bangyao; Sun, Fenglian; Li, Tianhui; Liu, Yang

doi:10.1007/s10854-019-02188-x

Cited by 4 publications

(7 citation statements)

References 16 publications

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“…As shown in the figure, the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu had a better creep resistance than Cu/Sn-5Sb/Cu. A previous study proved that the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu joint had better plasticity than Cu/Sn5Sb/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. Figure 1(c) is the shear distance-force of the joints, the plastic distance of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu was larger than that of Sn5Sb/Cu, and the force of Cu/Sn5Sb/Cu increased more sharply than Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c.…”

Section: Resultsmentioning

confidence: 95%

“…A previous study proved that the Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu joint had better plasticity than Cu/Sn5Sb/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. Figure 1(c) is the shear distance-force of the joints, the plastic distance of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu was larger than that of Sn5Sb/Cu, and the force of Cu/Sn5Sb/Cu increased more sharply than Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019c. In conclusion, the mechanical properties of Cu/Sn5Sb-0.5Cu-0.1Ni-0.5Ag/Cu, including the hardness, creep performance and plasticity, were much better than those of Cu/Sn-5Sb/Cu.…”

Section: Resultsmentioning

confidence: 95%

“…To narrow the research gap, a new low-cost lead-free solder alloy, Sn5Sb-0.5Cu-0.1Ni-0.5Ag, was obtained by adding Cu, Ni and Ag elements to the Sn5Sb matrix, which from previous studies, could be used in secondary reflow soldering processes such as double-sided circuit board SMT assembly (Han et al, 2019a(Han et al, , 2019b(Han et al, , 2019cLi et al, 2012;Hegde et al, 2009;Hammad, 2013). The alloy has the potential for application due to its better solderability than Sn5Sb.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Han

Sun

Zhang

et al. 2022

SSMT

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Purpose This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism. Design/methodology/approach The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints. Findings The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis for the development of Sn–Sb alloy with good mechanical properties. Originality/value This paper reveals that the hardness and the modulus of the bulk solder Cu/Sn–5Sb/Cu solder joints were improved with the addition of Cu, Ni and Ag trace elements. Meanwhile, the creep resistance and plasticity were also improved. This study has a great value for exploring high-performance Sn–Sb based solder alloy and has proved an example.

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Section: Resultsmentioning

confidence: 95%

Section: Resultsmentioning

confidence: 95%

Section: Introductionmentioning

confidence: 99%

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Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Han

Sun

Zhang

et al. 2022

SSMT

Self Cite

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“…Based on the previous analysis, Sn-Sb solid solution existed in Sn-5Sb-0.5Cu-0.1Ni-0.5Ag and Sn-5Sb solders (Han et al , 2019). The interaction between elastic distortion, which was caused by the radius difference between Sb and Sn atoms in solid solution and dislocation, hindered the movement of dislocations.…”

Section: Resultsmentioning

confidence: 98%

“…Some studies have indicated that the atomic radii of Sn and Sb are similar and the difference of atomic radius was 4%. Sb was solid soluble in β-Sn, and the replacement solid solution could be formed in Sn-Sb based solder, which played the role of solid solution strengthening (Han et al , 2020; Han et al , 2019). As a consequence, the shear strength and the bulk solder hardness of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu and Sn-5Sb/Cu solder joints were higher than those of SAC305/Cu solder joints before and after temperature cycling.…”

Section: Resultsmentioning

confidence: 99%

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

Sun

Pan

et al. 2022

SSMT

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Purpose The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder joints, which has important engineering and theoretical significance for the research of micro solder joint reliability. This paper also aims to provide guidance for the selection of solder for third-generation semiconductor power device packaging. Design/methodology/approach The shear strength, plasticity, bulk solder hardness and creep performance of three kinds of micro solder joints before and after temperature cycling were studied by nanoindentation and micro shear experiments. Scanning electron microscopy and energy dispersive spectrometry were used to analyze the fracture mode, fracture position and compound composition of the solder joints. Findings The bulk solder hardnesses and shear strengths of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were higher than those of Sn-5Sb/Cu and SAC305/Cu solder joints before and after temperature cycling. The indentation depth, creep displacement and creep rate of bulk solders of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were the smallest compared with those of Sn-5Sb/Cu and SAC305/Cu solder joints after the same number of cycles. In addition, the fracture mode and fracture position of the micro solder joints changed before and after temperature cycling. Originality/value A new type of solder was developed with excellent temperature cycling performance.

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In-situ tensile-shear test in SEM and DIC analysis of two pearlitic steel microstructures: undeformed-coarse and deformed-refined

Leão

Neto

Rodrigues

et al. 2023

Journal of Materials Research and Technology

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Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging

Cited by 4 publications

References 16 publications

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

In-situ tensile-shear test in SEM and DIC analysis of two pearlitic steel microstructures: undeformed-coarse and deformed-refined

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