This paper gives an overview of recent progress in developing diamond surface acoustic wave (SAW) devices for high‐frequency applications. We have studied high‐frequency SAW filters or resonators based on diamond thin films and demonstrated that diamond thin films have much potential for SAW applications above 3 GHz. Diamond film characteristics required for SAW filters in high‐frequency applications are clarified. The results of numerical calculations reveal that the diamond‐based SAW device, which employs a LiNbO3 thin film as the piezoelectric material, can provide a high electric coupling factor as well as a high phase velocity of more than 12 000 m/s. In contrast to when an AlN thin film is used as the piezoelectric material, the use of a SiO2/interdigital transducer/AlN/diamond structure enables the SAW device to have a low insertion loss for applications above 3 GHz.