Effect of chloride on Cu corrosion in anaerobic sulphide solutions

Chen, Jian; Qin, Z.; Martino, Taylor; Shoesmith, David W.

doi:10.1080/1478422x.2016.1271161

Cited by 30 publications

(38 citation statements)

References 11 publications

(22 reference statements)

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“…Although the location of the previously discussed base layer and its apparent thickness are indicated in Figure 8d, they are difficult to observe, owing to the presence of much larger features. The formation of such a thick crystalline outer deposit was consistent with our previous observations [ 6–15 ] and with our demonstration that growth of this deposit occurred at the film/solution interface, supported by the transport through the pores of the base layer of Cu(I), as both sulfide complexes (Cu(SH) 2 − ) and Cu 3 S 3 clusters, formed at the Cu surface. [ 15,24–29 ]…”

Section: Resultssupporting

confidence: 91%

“…Considerable effort has been expended on the investigation of the copper sulfide film formation process. [5][6][7][8][9][10][11][12][13][14][15] The physical properties of this chalcocite film have been demonstrated to vary significantly with sulfide concentration [SH − ], the flux of SH − to the Cu surface, and the presence of other groundwater anions (such as Cl − and SO 4…”

Section: Introductionmentioning

confidence: 99%

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The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

Guo

Chen

Martino

et al. 2020

Materials & Corrosion

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In this paper, the properties of copper sulfide films formed both anodically and naturally in deaerated/anoxic aqueous sulfide and chloride solutions were investigated using a series of electrochemical and surface analytical techniques. A combination of cyclic voltammetric, corrosion potential (Ecorr), and cathodic stripping voltammetric experiments showed that the sulfide film growth kinetics and film morphologies were controlled by the supply of SH− from the bulk solution to the copper surface. There was no passive barrier layer observed on the copper surface under either electrochemical or corrosion conditions. The film morphology was dependent on the type and concentration of anions (SH−, Cl−) present in the solution. Scanning electron microscopy on both surfaces and focused ion beam‐cut cross‐sections showed the growth of a thin, but porous, base layer of chalcocite (Cu2S) after short immersion periods (up to 2 hr) and the continuous growth of a much thicker crystalline outer deposit over longer immersion periods (≥36 hr), suggesting a solution species transport‐based film formation process and the formation of an ineffective thin “barrier‐type” layer on copper.

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Section: Resultssupporting

confidence: 91%

Section: Introductionmentioning

confidence: 99%

The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

Guo

Chen

Martino

et al. 2020

Materials & Corrosion

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“…From the EIS spectra, the phase gradually increases and shifts towards 45°after adding Cl − . This result is due to Cl − influencing the properties of the film [103]. This phenomenon is related to the adsorption of Cl − and the reduction in the thickness of the film.…”

Section: Effect Of Chloride-ion Concentrationmentioning

confidence: 99%

A review of passivity breakdown on metal surfaces: influence of chloride- and sulfide-ion concentrations, temperature, and pH

2021

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Metals, including austenitic steels and alloys, have been extensively applied in industrial and engineering applications. Passive films on metal surfaces are very important for corrosion protection. However, localized attack, such as passive film breakdown and the initiation of pits, is found upon exposure of such metals to aggressive ion-containing environments, leading to material failure and prominent adverse economic and safety concerns. For several decades, the mechanism of passivity breakdown and pit nucleation during pitting corrosion has been widely studied. The present article provides a detailed review of passive film breakdown on metal surfaces and the effects of complicated conditions, such as chloride- and sulfide-ion concentrations, temperature, and solution pH, on passivity breakdown. The possible mechanism for passivity breakdown is reviewed and discussed. The composition, structure, and electronic properties of passive layers are of conclusive importance to understand the leading corrosion mechanism, and they have been investigated with different techniques. Furthermore, we aim to present the structure, chemical composition, and electronic properties of passive films on metal surfaces by using X-ray photoelectron spectroscopy and energy-dispersive spectroscopy. Additionally, the surface morphology of passive films is analyzed by scanning electron microscopy (SEM), transmission electron microscopy (TEM), and atomic force microscopy (AFM) techniques. Finally, the effect of chloride- and sulfide-ion concentrations, pH, and temperature on passivity breakdown is discussed in detail.

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“…This experimental program, which has explored effects of sulfide concentration in the presence and absence of other anions has been supported by both SKB and the NWMO and has been extensively documented in the literature. [28][29][30][31][32] The work has demonstrated that in sulfide concentrations below 30 ppm, [28] the copper sulfide films will not be protective, particularly if sulfide movement is limited by slow diffusion. Rather, the corrosion product will remain porous, such that incoming sulfide will be able to continuously react at the copper surface.…”

Section: The Anoxic Corrosion Of Copper In the Presence Of Sulfidementioning

confidence: 99%

An update on the copper corrosion program for the long‐term management of used nuclear fuel in Canada

Keech

Behazin

Binns

et al. 2020

Materials & Corrosion

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In 2012, the Nuclear Waste Management Organization developed a comprehensive proof test plan (PTP) to evaluate the feasibility and safety of their copper‐coated used fuel container and their novel bentonite buffer box emplacement concept to be employed in its proposed deep geological repository for the long‐term management of used nuclear fuel. Research within the PTP includes several programs to evaluate the possible extent of damage that may be caused by various copper corrosion mechanisms: oxic‐, radiolytic‐, anoxic‐, and sulfide‐induced, with particular attention being paid to the possibility of localization of any of these processes. Programs remain on track to support and refine a maximum copper corrosion allowance of <1.27 mm over a one million year emplacement in a deep geological repository.

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Effect of chloride on Cu corrosion in anaerobic sulphide solutions

Cited by 30 publications

References 11 publications

The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

A review of passivity breakdown on metal surfaces: influence of chloride- and sulfide-ion concentrations, temperature, and pH

An update on the copper corrosion program for the long‐term management of used nuclear fuel in Canada

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