Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber composites

Di, Lizhi; Liu, Bin; Song, Jing; Shan, Dan; Yang, De’an

doi:10.1016/j.apsusc.2010.12.035

Cited by 36 publications

(16 citation statements)

References 7 publications

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“…It restricts their use in some electronic field, such as electromagnetic interference (EMI) shielding. Wang et al [4] reported that the average shielding effectiveness (SE) of PEEK composites with 7 wt% multiwalled carbon nanotubes (MWCNT) loading was only about 10 dB for frequencies lower than 8 GHz, though it reached 40 dB in [8][9][10][11][12] Copper is an excellent conductor of electricity and can absorb and reflect EMI. Jiang et al [5] reported that the SE value of Cu-Ni-P plated polyester fabric reached 70 dB in 2-18 GHz.…”

Section: Introductionmentioning

confidence: 99%

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Zhai

Ding

et al. 2015

Materials Letters

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Section: Introductionmentioning

confidence: 99%

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Zhai

Ding

et al. 2015

Materials Letters

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“…A selection amongst the wealth of publications can be found in Refs. [5][6][7][8][9][10][11][12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Toward a computational and experimental model of a poly-epoxy surface

Duguet

Bessaguet

Aufray

et al. 2015

Applied Surface Science

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a b s t r a c tA model poly-epoxy surface formed by the reaction of DGEBA and EDA is studied by the combination of experiments and DFT calculations. A special synthesis protocol is presented leading to the formation of a surface that is smooth (S a < 1 nm), chemically homogeneous, and that presents a low-defect density (0.21 m −2 ), as shown by AFM characterizations. Then, XPS is used for the determination of the elemental and functional groups' surface composition. DFT allows the identification and assignment of individual bonds contributions to the experimental 1s core-level peaks. Overall, we demonstrate that such a model sample is perfectly suitable for a use as a template for the study of poly-epoxy surface functionalization.

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“…In conventional electroless plating process, the metal-tosubstrate adhesion is on the formation of mechanical anchoring through an etching process. However, the substrate surface is usually etched with strong acid reagents [28]. Since SPF is a kind of regenerated protein fiber, its exposure to acid solutions may result in the deactivation of protein.…”

Section: Discussionmentioning

confidence: 99%

An efficient method to functionalize soybean protein fiber for fuse wire application

Zhao

2015

J Mater Sci: Mater Electron

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An etchant-free surface pre-treatment process for the preparation of copper/soybean protein fiber (Cu/ SPF) via electroless plating was studied. A tight, dense and continuous structure of copper coating was obtained in this process. 3-Aminopropyltrimethoxysilane molecule was successfully grafted onto the SPF via a simple coupling reaction. In addition, Au, Ag or Pd nanoparticles were immobilized on the SPF substrate as catalyst sites for electroless plating. All the copper coatings via different metal activation were firmly adhered to the SPF substrate, as determined by an adhesive scotch Ò -tape test. The measurement of the electrothermal property of the Cu/SPF composites was carried out by a home-made direct current circuit. The composite from Ag activation process held a relatively higher rated current and a lower melting point, which indicated that it was more suitable to be made as the fuse wire than the composites from Au or Pd activation process.

show abstract

Effect of chemical etching on the Cu/Ni metallization of poly (ether ether ketone)/carbon fiber composites

Cited by 36 publications

References 7 publications

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Autocatalytic deposition of copper coating on poly (ether ether ketone)/multiwalled carbon nanotubes composites via a palladium-free and simplified electroless process

Toward a computational and experimental model of a poly-epoxy surface

An efficient method to functionalize soybean protein fiber for fuse wire application

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