Effect of bonding conditions on joints of 5052Al and 6063Al in pulsed electric current bonding

Kondou, Katsuya; Matsumoto, Nobuhiro; Wada, Kouji; Ohashi, Osamu

doi:10.1080/09507110902836952

Cited by 5 publications

(5 citation statements)

References 11 publications

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“…The equipment is composed of a pulsed electric power source, hydraulic pressure system, vacuum chamber/evacuation system and thermal controller. 12 The Al6061 and SS304 discs were placed between graphite punches with an inserted aluminium powder as shown in the magnified section in Fig. 1.…”

Section: Methodsmentioning

confidence: 99%

“…8 Pulsed electric current sintering (PECS) 9,10 is a novel fast sintering process, by which powder can be rapidly heated and sintered in a relatively low temperature. At present, researchers [11][12][13][14][15][16][17] have attempted to introduce this process into the welding field called PECS bonding. Kondou et al 12 systematically studied the effect of bonding conditions on joints of 5052Al and 6063Al in PECS bonding.…”

Section: Introductionmentioning

confidence: 99%

“…At present, researchers [11][12][13][14][15][16][17] have attempted to introduce this process into the welding field called PECS bonding. Kondou et al 12 systematically studied the effect of bonding conditions on joints of 5052Al and 6063Al in PECS bonding. Their results showed that using 2024Al powder instead of a plate as an interlayer between the bonding interfaces can greatly improve the joint strength.…”

Section: Introductionmentioning

confidence: 99%

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Parameter optimisation and microstructural characterisation of pulsed electric current bonded Al6061-SS304 joints

Liu

Zhang

Xia

et al. 2016

Science and Technology of Welding and Joining

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The pulsed electric current bonding method was adopted to join Al6061 and SS304 using an aluminium powder as the interlayer. Taguchi method was performed to optimise the bonding parameters. The decreasing sequence of factors affecting the shear strength of the joints is bonding temperature, surface treatment and holding time. The microstructural characterisation and shear fracture of the optimal joint have been further analysed. A uniform diffusion layer was formed at the Al/SS304 interface, and the high hardness value of the layer could be attributed to the formation of the intermetallic compounds. The most promising joint was obtained under the optimal parameter condition, and failure of the joint was caused inside the Al interlayer.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Parameter optimisation and microstructural characterisation of pulsed electric current bonded Al6061-SS304 joints

Liu

Zhang

Xia

et al. 2016

Science and Technology of Welding and Joining

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“…It was presumed that the oxide film was destroyed by direct energization on the contact surface, and a good joint with no inclusions was obtained. There are some examples regarding the report of joining dissimilar metal by the pulsed current under low vacuum lesser than below 10 Pa. 20,22) 3.4 XRD analysis of fractured surface Figure 7 shows the XRD pattern of the OFC and SUS304 fractured surfaces. The diffraction line of Cr 23 C 6 was detected on the SUS304.…”

Section: Observation Of the Cross-sectional Microstructurementioning

confidence: 99%

Pulsed-Electric-Current Bonding of Oxygen-Free Copper and Austenitic Stainless Steel

Nakao

Nishimoto

2021

Mater. Trans.

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Although pure copper has good electrical and thermal conductivity, it is often used in combination with other metals due to its poor strength. An inexpensive austenitic stainless steel that has excellent corrosion resistance is a good joining material for pure copper, and the joining of these dissimilar metals enables the fabrication of parts for a wide range of applications. However, it is difficult to weld pure copper and stainless steel due to the large differences between their thermal properties. Therefore, in this study, the pulsed-electric-current bonding was applied to achieve solid state bonding of oxygen-free copper (OFC) and SUS304 austenitic stainless steel, and the bonding characteristics were investigated. The results show that the joint tensile strength improves with the increase in the bonding temperature and the applied pressure, and the sample bonded at 973 K with an applied pressure of 20 MPa exhibited a high strength of greater than 200 MPa, which caused a fracture in the OFC base material.

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“…SPS, also referred to as pulsed electric current sintering (PECS) or field assisted sintering technique (FAST), has recently gained popularity for sintering powdered metals and ceramics 22 and has also been used to successfully bond metals and ceramics. [23][24][25][26][27] The primary difference between an SPS press and a hot press is that the SPS press applies a large pulsed dc current density on the order of 1000A/cm 2 to the samples to be bonded in order to rapidly heat them via localized resistive heating instead of using an external heat source. Other benefits of using SPS processes over other traditional bonding techniques include faster heating and cooling rates, a lower overall sintering temperature, and much shorter holding times to achieve similar results to hot presses.…”

Section: Bonding Via Spark Plasma Sintering (Sps) Technologymentioning

confidence: 99%

Development of a sapphire optical pressure sensor for high-temperature applications

et al. 2014

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This paper presents the fabrication, packaging, and characterization of a sapphire optical pressure sensor for hightemperature applications. Currently available instrumentation poses significant limitations on the ability to achieve realtime, continuous measurements in high-temperature environments such as those encountered in industrial gas turbines and high-speed aircraft. The fiber-optic lever design utilizes the deflection of a circular platinum-coated sapphire diaphragm to modulate the light reflected back to a single send/receive sapphire optical fiber. The 7 mm diameter, 50 μm thick diaphragm is attached using a novel thermocompression bonding process based on spark plasma sintering technology. Bonds using platinum as an intermediate layer are achieved at a temperature of 1200°C with a hold time of 5 min. Initial characterization of the bond interface using a simple tensile test indicates a bond strength in excess of 12 MPa. Analysis of the buckled diaphragm after bonding is also presented. The packaged sensor enables continuous operation up to 900°C. Room-temperature characterization reveals a first resonance of 18.2 kHz, a flat-band sensitivity of -130 dB re 1 V/Pa (0.32 μV/Pa) from 4-20 kHz, a minimum detectable pressure of 3.8 Pa, and a linear response up to 169 dB at 1.9 kHz.

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Effect of bonding conditions on joints of 5052Al and 6063Al in pulsed electric current bonding

Cited by 5 publications

References 11 publications

Parameter optimisation and microstructural characterisation of pulsed electric current bonded Al6061-SS304 joints

Parameter optimisation and microstructural characterisation of pulsed electric current bonded Al6061-SS304 joints

Pulsed-Electric-Current Bonding of Oxygen-Free Copper and Austenitic Stainless Steel

Development of a sapphire optical pressure sensor for high-temperature applications

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